Stamp used in printed circuit manufacturing process, method for manufacturing the same, and printed circuit manufacturing process
A technology of printed circuit and manufacturing method, which is applied in the field of stamps and its manufacturing method and printed circuit manufacturing process, can solve problems such as circuit errors, and achieve the effects of reducing contact area, improving resolution, and increasing contact angle
Active Publication Date: 2020-02-28
WINBOND ELECTRONICS CORP
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Therefore, during the process of reprinting the circuit, the ink on the concave surface of the stamp will also adhere to the substrate to be reprinted, causing circuit errors
Method used
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Embodiment Construction
[0019] Figure 1A to Figure 1D It is a schematic cross-sectional view showing the manufacturing process of the stamp used in the printed circuit process according to an embodiment of the present invention.
[0020] Please refer to Figure 1A , patterning the substrate 100 to form grooves 102 in the substrate 100 . A method for patterning the substrate 100 is, for example, performing a lithography process and an etching process. For example, a patterned mask layer (not shown) is firstly formed on the substrate 100 to expose part of the substrate 100 . Afterwards, an etching process is performed on the exposed part of the substrate 100 by using the patterned mask layer as a mask. Then, the patterned mask layer is removed to form the groove 102 , wherein the shape of the pattern of the groove 102 is the same as the shape of the circuit pattern formed on the substrate for imprinting by subsequent imprinting process. The width of the groove 102 can be controlled by the interval ...
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Abstract
The invention provides a seal used for a printed circuit manufacturing procedure, a manufacturing method of the seal, and the printed circuit manufacturing procedure. The seal comprises a main body structure, a micron bulge structure and a plurality of nano cone structures. The micron bulge structure is located on the main body structure. The multiple nano cone structures are located on the main body structure and surround the micron bulge structure. The seal can provided with the hydrophilic surface and the hydrophobic surface simultaneously. When an ink spraying manufacturing procedure is conducted, an ink layer is only formed in the surface provided with the micron bulge structure, and attaching of ink on the surface provided with the nano cone structures can be avoided; and when circuit patterns are subjected to transfer printing to other base materials such as a semiconductor, the resolution of the circuit patterns on the base materials and the manufacturing procedure stability of the transfer printing circuit patterns can be improved.
Description
technical field [0001] The invention relates to a stamp, a manufacturing method thereof, and a printed circuit process, in particular to a stamp used in the printed circuit process, its manufacturing method, and the printed circuit process. Background technique [0002] In today's printed circuit manufacturing process, compared to inkjet printing, transfer printing by stencil is considered to have more potential for mass production. However, whether it is a hard template or a soft template obtained by secondary printing, when it is used as a stamp and used to attach conductive ink or semiconductor ink, excess ink will be attached to the concave (negative) side of the stamp . Therefore, during the process of reprinting the circuit, the ink on the concave surface of the stamp will also adhere to the substrate to be reprinted, causing circuit errors. In the traditional reprinting circuit manufacturing process, the resolution of the reprinted circuit is sacrificed to improve t...
Claims
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IPC IPC(8): B41K1/02B41K1/38B41C1/14B41N1/12
CPCB41C1/14B41K1/02B41K1/38B41N1/12
Inventor 何羽轩
Owner WINBOND ELECTRONICS CORP