Forested coating film
A film-coating and forest-flavored technology, applied in coatings, conductive coatings, antifouling/underwater coatings, etc., can solve problems such as poor lubricity, moisture retention and antistatic properties, toxic gases, strong odor, etc., to achieve Excellent lubricity, prevention of disease and sub-health, and improvement of human sleep
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Embodiment 1
[0013] Embodiment 1: The total amount of Senwei coating film is 1042.8g
[0014] Its raw material composition percentage includes: 18.3% HP, 0.56% dispersant, 0.22% defoamer, 0.43% wetting agent, 5.5% polyethylene glycol, 0.23% preservative, 0.52% antifungal agent, 0.52APM-95, 31.5% negative ion stock solution, 41.5% resin, 2.5% film-forming aid, 2.5% anti-formaldehyde additive.
[0015] The amount of raw materials includes: 183gHP, 5.6g dispersant, 2.2g defoamer, 4.3g wetting agent, 55g polyethylene glycol, 2.3g preservative, 5.2g antifungal agent, 5.2gAPM-95, 315g negative ion stock solution, 415g resin, 25g film-forming aid, 25g anti-formaldehyde additive.
[0016] The raw material components include: 18.3% HP, 0.56% dispersant, 0.22% defoamer, 0.43% wetting agent, 5.5% polyethylene glycol, 0.23% preservative, 0.52% antifungal agent, 0.52APM-95 , 31.5% negative ion stock solution, 41.5% resin, 2.5% film-forming additives, 2.5% anti-formaldehyde additives.
[0017] The ra...
Embodiment 2
[0019] Embodiment 2: The total amount of Senwei coating film is 1060.7g
[0020] Its raw material composition percentage includes: 18.4% HP, 0.5% dispersant, 0.23% defoamer, 0.44% wetting agent, 5.8% polyethylene glycol, 0.24% preservative, 0.53% antifungal agent, 0.53% APM-95 , 32% negative ion stock solution, 42% resin, 2.6% film-forming aid, 2.8% anti-formaldehyde additive.
[0021] The amount of raw materials includes: 184gHP, 5g dispersant, 2.3g defoamer, 4.4g wetting agent, 58g polyethylene glycol, 2.4g preservative, 5.3g antifungal agent, 5.3gAPM-95, 320g negative ion stock solution, 420g Resin, 26g film-forming aid, 28g anti-formaldehyde additive.
[0022] The raw material components include: 18.4% HP, 0.5% dispersant, 0.23% defoamer, 0.44% wetting agent, 5.8% polyethylene glycol, 0.24% preservative, 0.53% antifungal agent, 0.53% APM- 95. 32% negative ion stock solution, 42% resin, 2.6% film-forming aid, 2.8% anti-formaldehyde additive.
[0023] Said raw material do...
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