Electronic component and overmolding process

Abstract

The invention discloses an electronic component and an overmolding process. The electronic component (100), such as an antenna, includes a substrate (101), an overmolding (103) bonded to at least a portion of the substrate, the overmolding being a non-planar arrangement of a polymeric material, and a conductive ink (105) positioned on the substrate between the substrate and the overmolding. The conductive ink is devoid or substantially devoid of delamination or fracture from the bonding of the overmolding to the substrate. The overmolding process includes providing a substrate, applying a conductive ink onto the substrate, and bonding an overmolding to at least a portion of the substrate, the overmolding being an arrangement of a polymeric material.

Description

technical field [0001] The invention relates to an electronic component and an injection molding method. More specifically, the present invention relates to electronic components having similar coefficients of thermal expansion. Background technique [0002] The manufacture of electronic components is constantly faced with the need to improve quality, reduce cost and allow for greater complexity. However, many methods of manufacturing higher quality electronic components are cost prohibitive. Also, forming complex designs can be costly. Using low-cost methods seems ideal, but often results in undesirably low quality or limits on complexity. [0003] A relatively well-known low-cost method of manufacturing parts is injection molding. Injection molding involves heating the material to temperatures of up to 300°C. Such temperatures are not beneficial to many materials and may cause the material to crack, delaminate, or have other detrimental effects. As such, the use of i...

AI Technical Summary

Problems solved by technology

However, these techniques can suffer from drawbacks such as lack of uniformity, formation of parting lines or streaks, and creation of additional break points

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