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Resin molding device, resin molding method, and injection device for fluid material

A technology of resin molding and fluidity, applied in the field of injection devices, can solve the problems of increased device cost and complex device structure, and achieve the effect of reducing the deviation of injection amount

Active Publication Date: 2019-08-16
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in order to perform multi-chamber operation, the structure of the device becomes complicated, and the cost of the device also increases

Method used

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  • Resin molding device, resin molding method, and injection device for fluid material
  • Resin molding device, resin molding method, and injection device for fluid material
  • Resin molding device, resin molding method, and injection device for fluid material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0036] (Structure of resin molding device)

[0037] refer to figure 1 , the structure of the resin molding apparatus of the present invention will be described.

[0038] figure 1 The shown resin molding apparatus 1 is, for example, a resin molding apparatus using a compression molding method. The resin molding apparatus 1 includes a substrate supply and storage module 2 , four molding modules 3A, 3B, 3C, and 3D, and a resin supply module 4 as constituent elements, respectively. The substrate supply and storage module 2, the molding modules 3A, 3B, 3C, and 3D, and the resin supply module 4, which are structural elements, are detachable and replaceable from each other with respect to other structural elements.

[0039] The substrate supply and storage module 2 is provided with: a pre-package substrate supply part 6 for supplying the pre-package substrate 5 ; and a post-package substrate storage part 8 for storing the post-package substrate 7 . For example, a semiconductor ...

Embodiment approach 2

[0087] (Structure of Resin Injection Section)

[0088] refer to Figure 5 , Embodiment 2 of the resin injection unit used in the resin molding apparatus 1 will be described. The difference from Embodiment 1 is that more nozzles and parallel runners are provided in the resin injection part.

[0089] Such as Figure 5 As shown in (b), the resin injection part 46 is equipped with the flow path member 47, and the flow path member 47 is equipped with the nozzle 48 arrange|positioned in a row. Figure 5 A case where four nozzles 48 are provided in the flow path member 47 is shown. Not limited thereto, five or more nozzles 48 may be provided, and two or three nozzles may be provided.

[0090] Provided in the flow channel member 47 are: a resin inflow port 40 into which the liquid resin 25 is supplied; and branch flow channels 41 extending horizontally from the resin inflow port 40 toward both sides. In each nozzle 48, a plurality of side-by-side flow paths 42a branched from the ...

Embodiment approach 3

[0109] (Structure of Resin Injection Section)

[0110] refer to Figure 6 , Embodiment 3 of the resin injection unit used in the resin molding apparatus 1 will be described. The difference from Embodiment 2 is that each rotating body 45 is rotated in the same direction at the same speed by using a combination of gears instead of a combination of a pulley and a belt.

[0111] Such as Figure 6 As shown in (b), since the structures of the resin injection part 46 , the flow channel member 47 , the nozzle 48 , the rotating body 45 , the rotating shaft 49 , and the supporting member 50 are completely the same as those in Embodiment 2, description thereof will be omitted.

[0112] Such as Figure 6 As shown in (a), at one end of each rotating shaft 49 (at Figure 6 (b) is the upper end), respectively connected with the gear 53 as a linkage mechanism. Between the adjacent gears 53 and the gears 53, other gears 54 as linkage mechanisms are respectively arranged and meshed with ea...

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PUM

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Abstract

The invention provides a resin forming device, a resin forming method, and an injection device of a flowing material. The object of the invention is to reduce injection amount deviation of flowing resin injected through a plurality of injection openings. The resin forming device has a forming die, which has a mold cavity disposed on at least one of an upper die and a lower die in an opposite arrangement; a resin injection mechanism, which is used to inject the flowing resin to the mold cavity; and a die combining mechanism, which is used for the die combining of the forming die. The resin injection mechanism comprises a flowing channel part, which comprises branch channels disposed between the flowing inlet of the flowing resin and the injection openings; a rotating bodies, which are disposed in the various branch channels, and are rotated along with the flowing of the flowing resin; a linkage mechanism, which is used to rotate the various rotating bodies in the branch channels in a linked way. The injection amount deviation of the flowing resin injected by the plurality of injection openings is easily reduced.

Description

technical field [0001] The present invention relates to resin encapsulation of chip-shaped electronic components (hereinafter, appropriately referred to as "chips") such as transistors, integrated circuits (Integrated Circuit: IC), and light emitting diodes (Light Emitting Diode: LED) using liquid resin. Resin molding equipment, resin molding methods, and injection equipment for fluid materials used in cases such as In this application document, the term "liquid" means that it is liquid at normal temperature and has fluidity, and does not relate to the level of fluidity, in other words, the degree of viscosity. Background technique [0002] Conventionally, semiconductor chips mounted on substrates have been resin-encapsulated using liquid resins made of thermosetting resins such as silicone resins and epoxy resins. Resin molding techniques such as compression molding and transfer molding can be used for resin encapsulation. In resin molding using a liquid resin, auxiliary ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C43/34B29C43/56H01L21/56B29C48/345B29C48/395
CPCB29C43/34B29C43/56B29C2043/3405B29C2043/561H01L21/56B29C48/0011B29C48/30B29C48/345B29C48/395B29C2043/3433
Inventor 後藤智行岩田康弘花坂周邦
Owner TOWA