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Main control chip heating device and method

A main control chip and heating device technology, applied in temperature control, non-electric variable control, control/regulation system, etc., can solve the problems of slow system startup and high cost, and achieve the effect of temperature control and cost reduction

Inactive Publication Date: 2017-10-20
SHENZHEN GONGJIN ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, it is necessary to provide a heating device for the main control chip that can effectively reduce the cost and make the main control chip meet the low temperature and fast start requirements for the problem that the traditional main control chip heating method is too high in cost and causes the system to start slowly. and method

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  • Main control chip heating device and method
  • Main control chip heating device and method
  • Main control chip heating device and method

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. It can be understood that the terms "first", "second" and the like used in the present invention can be used to describe various elements herein, but these elements are not limited by these terms. These terms are only used to disting...

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Abstract

The invention relates to a main control chip heating device and method. The main control chip heating device comprises a main control module, a temperature detection module, a comparison module and a heating module, and is characterized in that the main control module controls a back-end circuit to turn on a heating mode or turn off the heating mode through receiving a first control signal sent by a main control chip; the temperature detection module is connected with the main control module and used for detecting the temperature of the main control chip and feeding back a voltage value to the main control module according to the detected temperature; the comparison module is connected with the main control module, compares the voltage value fed back by the temperature detection module with a preset voltage value and outputs a second control signal according to the comparison result to control turn-on / off of heating; and the heating module is connected with the comparison module and used for heating the main control chip. The main control chip is enabled to quickly reach a temperature required by operations at a low temperature condition. In addition, the heating temperature of the main control chip is controllable, and the cost of the main control chip in the heating process can be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a heating device and method for a main control chip. Background technique [0002] At present, most camera products are required to be able to work at -20 degrees or lower temperature conditions, but the general main control chip cannot meet the lower working temperature requirements. If you choose military-grade products, the cost will be very high. high. [0003] The choice based on the current low temperature working environment is mainly limited by the minimum working temperature of the chip. In the case of application, it is often necessary to replace the chip with a lower operating temperature, which brings great challenges to product cost control. Secondly, the traditional product heating design adopts cavity heating to meet the requirements of chip operating temperature, but the cavity heating uses high-power heating wires, and long-term heating will lead to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/24
CPCG05D23/24
Inventor 陈进奖张鑫方旭逢
Owner SHENZHEN GONGJIN ELECTRONICS CO LTD