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Light-emitting diode chip

A light-emitting diode and chip technology, applied to electrical components, circuits, semiconductor devices, etc., can solve problems affecting the service life of light-emitting diode chips, temperature rise, etc., and achieve the effects of simple structure, extended service life and reasonable design

Active Publication Date: 2017-11-07
NANTONG MINICHIP MICRO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the light-emitting diode chip installed in the circuit will be affected by other electronic components in the circuit. The heat emitted by other electronic components in the circuit will increase the temperature of the light-emitting diode chip and affect the service life of the light-emitting diode chip.

Method used

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  • Light-emitting diode chip

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Embodiment Construction

[0012] In order to enhance the understanding of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments, which are only used to explain the present invention and do not limit the protection scope of the present invention.

[0013] like figure 1 As shown, the present invention is a light-emitting diode chip, including a chip body. The chip body includes a substrate 1, an epitaxial layer 2 is arranged on the substrate 1 layer, and an N-type conductive region 3 and a P-type conductive region 3 are arranged on the epitaxial layer 2. Region 4, an active region 5 is set between the N-type conductive region 3 and the P-type conductive region 4, an insulating layer is arranged on the side of the N-type conductive region 3 and the active region 5, and the P-type conductive region on the right side of the insulating layer A conductive transparent oxide film layer 6 is provided on the area 4, a P...

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Abstract

The invention discloses a light-emitting diode chip, which comprises a chip body, the chip body comprises a substrate, an epitaxial layer is arranged on the substrate layer, N type and P type conducting areas are arranged on the epitaxial layer, an active area is arranged between the N-type conducting area and the P-type conducting area, an insulating layer is arranged on the side of the N-type conducting area and the active area, a conductive transparent oxide film layer is arranged on the right side of the insulating layer and the upper surface of the N-type conducting area, a P-type electrode and an N-type electrode are arranged on the conductive transparent oxide film layer, the side of the chip body is provided with an insulating layer which is used for isolating the P-type electrode from the chip body and isolating the N-type electrode from the chip body, a lower end of the chip body is fixed on an insulated thermal insulation fixing plate, and the insulated thermal insulation fixing plate is provided with pin lead-out holes, two sides of the chip body are provided with a plurality of pins which are used for connecting with the N-type electrode and the P-type electrode. The light-emitting diode chip is simple in structure, reasonable in design and low in cost, has a long service life and can avoid being influenced by other electronic components.

Description

technical field [0001] The invention relates to a chip, in particular to a light emitting diode chip. Background technique [0002] At present, the light-emitting diode chip installed in the circuit will be affected by other electronic components in the circuit. The heat emitted by other electronic components in the circuit will increase the temperature of the light-emitting diode chip and affect the service life of the light-emitting diode chip. Contents of the invention [0003] In order to solve the above problems, the present invention provides a light emitting diode chip that is not affected by other electronic components. [0004] In order to achieve the above object, the present invention is achieved through the following technical solutions: [0005] The invention relates to a light emitting diode chip, which includes a chip body. The chip body includes a substrate, an epitaxial layer is arranged on the substrate layer, an N-type conductive region and a P-type con...

Claims

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Application Information

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IPC IPC(8): H01L33/48
Inventor 周明
Owner NANTONG MINICHIP MICRO ELECTRONICS