Temperature compensation equalization circuit of TR assembly

A technology of equalizing circuit and equalizing resistance, which is applied in the direction of voltage/temperature change compensation, electrical components, amplification control, etc. It can solve problems such as poor temperature compensation effect in high frequency bands, high and low temperature gain fluctuations, and inability to dynamically adjust, etc., to achieve gain balance Adjustable volume, adjustable temperature compensation range, and improved productivity

Active Publication Date: 2017-11-24
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The gain of the amplifier has a negative temperature characteristic (that is, the gain decreases as the temperature increases). Due to the use of multi-stage amplifiers, the high and low temperature gain fluctuations of TR components that do not use temperature compensation technology can reach about 10dB.
In order to reduce the temperature gain fluctuation of TR components, temperature compensation technology is generally used. The traditional temperature compensation chip uses a thermistor to form a T-type or PI-type attenuator to realize the temperature compensation function, which has the disadvantages of large insertion loss and cannot be adjusted dynamically. Due to the skin effect, the temperature compensation effect of the steady attenuator is poor in the high frequency band

Method used

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  • Temperature compensation equalization circuit of TR assembly
  • Temperature compensation equalization circuit of TR assembly
  • Temperature compensation equalization circuit of TR assembly

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specific Embodiment 1

[0029] A temperature compensation equalization circuit of a TR component, comprising a temperature compensation circuit and an equalization circuit; the temperature compensation circuit adopts a PIN die and a DC bias circuit to realize the temperature compensation function; the DC bias circuit is composed of a fixed resistance and a thermistor connected in series; the fixed resistor and the thermistor are sequentially connected to a choke inductance and a diode, and then grounded; the choke inductance is connected to the anode of the diode; the anode of the diode is respectively connected to a temperature compensation through a coupling capacitor input and output terminals of the circuit.

[0030] The temperature compensation circuit among the present invention is as figure 1 As shown, the PIN die + peripheral DC bias circuit is used to realize the temperature compensation function. When the temperature is high, the resistance of the thermistor is almost 0 ohms, so that the PI...

specific Embodiment 2

[0031] On the basis of specific embodiment 1, the equalization circuit, such as figure 2 As shown, including the balanced resistance realized on the open transmission line by adopting the microstrip open circuit stub + lumped resistance; the balanced resistance is realized on the alumina ceramic substrate with gold plating and TaN resistance film, and realized through the gold wire welding process The short circuit condition of the two balancing resistors.

[0032] The equivalent circuit of the equalization circuit is as image 3 As shown, the working principle of the equalization circuit is that the input impedance of the open circuit stub is Zin=-j*Z0*cot (2πL / λ), where Z0 is the characteristic impedance of the transmission line, L is the length L of the open circuit transmission line, and λ is the microwave signal wavelength. When the length of the open-circuit transmission line remains unchanged, assuming that the wavelength corresponding to the frequency f0 is λ0, and ...

specific Embodiment 3

[0033] On the basis of the specific embodiment 2, the balancing resistor includes more than two series balancing resistors, and in this specific embodiment, includes two series balancing resistors R1 and R2. Using more than two balancing resistors in series can effectively improve the balancing accuracy, but the number of balancing resistors should be reasonably designed according to the influence of distributed capacitance.

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Abstract

The present invention provides a temperature compensation equalization circuit of a TR assembly. The temperature compensation equalization circuit comprises a temperature compensation circuit and an equalization circuit, and the temperature compensation circuit adopts a PIN diode core and a DC bias circuit to realize a temperature compensation function. The DC bias circuit is formed by connecting a fixed resistor and a thermistor in series, the equalization circuit comprises the equalization resistors realized by a micro-strip open circuit stud and a lumped resistor on an open circuit transmission line, the equalization resistors are realized by the gold plated alumina ceramic substrates and the TaN resistive films, and the short circuit state of the two equalization resistors is realized by a gold wire welding technology. The temperature compensation equalization circuit can be applied to the ultra wide band TR assembly better, solves the problem that the ultra wide band TR assembly is large in gain fluctuation within the frequency bands and large in high-low temperature gain fluctuation, especially has the greater advantage in the amplitude consistency index debugging of the multiple TR assemblies.

Description

technical field [0001] The invention relates to a temperature compensation and equalization circuit of a TR component, in particular to a temperature compensation and balance circuit suitable for an ultra-wideband TR component. Background technique [0002] In recent years, active phased array technology has been widely used in electronic warfare equipment, and great breakthroughs have been made in equipment performance. The TR component is the basis of the phased array antenna and the core component of the active phased array. Since it is used in the field of electronic warfare, ultra-wideband and miniaturization are its necessary technical features. [0003] At present, multi-function chips and high-density integration technology are widely used in electronic warfare TR components to realize their ultra-wideband and miniaturization technical characteristics, but there are also technical difficulties such as large gain fluctuations in the application frequency band and larg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03G5/16H03K19/003
CPCH03G5/165H03K19/00369
Inventor 王超杰周丽揭海季兴桥姚瑞林余雷
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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