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Highly integrated ultra-broadband microstrip line vertical transition for tiled tr modules

A technology of vertical transition and microstrip line, which is applied in the field of microwave transmission, can solve the problem that signals cannot be transmitted, and achieve the effect of reducing attenuation and improving efficiency

Active Publication Date: 2019-03-08
中国人民解放军火箭军研究院 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, since the signal needs to be transmitted through the conductor strip on the upper surface of the dielectric substrate and the ground plane on the lower surface of the dielectric substrate at the same time, when the ground planes of the two microstrip lines are completely disconnected, the signal cannot be transmitted

Method used

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  • Highly integrated ultra-broadband microstrip line vertical transition for tiled tr modules
  • Highly integrated ultra-broadband microstrip line vertical transition for tiled tr modules
  • Highly integrated ultra-broadband microstrip line vertical transition for tiled tr modules

Examples

Experimental program
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Effect test

Embodiment 1

[0029] refer to Figure 2A , shows a highly integrated ultra-broadband microstrip line vertical transition suitable for tiled TR modules. The microstrip vertical transition may specifically include:

[0030] The first microstrip line 10 , the first gold wire 20 , the second gold wire 30 , the third gold wire 40 and the second microstrip line 50 .

[0031] One of the two ends of the arc-shaped T-shaped junction of the conductor strip of the first microstrip line 10 is connected to the first gold wire 20, and the other end of the two ends of the arc-shaped T-shaped junction of the conductor strip of the first microstrip line 10 Connect second gold wire 30; Silk 30.

[0032] The central ground plane of the first microstrip line 10 is connected to the third gold wire 40; the central ground plane of the first microstrip line 10 is the bottom ground plane of the first microstrip line 10 extending to the conductor strip of the first microstrip line 10 The semicircular part of the ...

Embodiment 2

[0038] refer to image 3 , shows a flow chart of a microstrip line signal transmission method, the method is applied to a tile-type TR module including at least two microstrip lines, and the method may specifically include the following steps:

[0039] Step 301: The first current is respectively input to the first gold wire and the second gold wire through the two ends of the arc-shaped T-junction of the conductor strip of the first microstrip line; the two ends of the first gold wire are respectively connected to the first microstrip line One of the two ends of the arc-shaped T-shaped junction of the conductor strip of the second microstrip line, and one of the two ends of the arc-shaped T-shaped junction of the conductor strip of the second microstrip line, and the two ends of the second gold wire are respectively connected to the two ends of the first microstrip line. The other end of the two ends of the arc-shaped T-shaped junction of the conductor strip, and the other end...

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Abstract

The embodiment of the invention provides a highly-integrated and ultra-wideband microstrip line vertical transition device applicable to a tile-type transmitter and receiver (TR) module and a signal transmission method of a microstrip line, and belongs to the technical field of microwave transmission. The method comprises the steps of inputting a first current into a first gold wire and a second gold wire respectively by two ends of an arc T-shaped junction of a conductor band of a first microstrip line; and inputting a second current to a third gold wire by a central grounding plate of the first microstrip line so that an electromagnetic field formed by the first current and the second current is transmitted to a second microstrip line. The first gold wire, the second gold wire and the third gold wire can form a transmission line similar to a coaxial structure, so that the signal attenuation can be greatly reduced when the first microstrip line is transmitted to the second microstrip line by the transmission line similar to the coaxial structure, and the signal transmission efficiency is improved.

Description

technical field [0001] The invention relates to the field of microwave transmission technology, in particular to a microstrip line signal transmission method and a highly integrated ultra-broadband microstrip line vertical transition suitable for tile-type TR modules. Background technique [0002] As the core component of the wireless transceiver system, the TR (Transmitter and Receiver) module of the tile structure can amplify, phase shift and attenuate the signal received by the antenna, and then transmit it to the processing unit of the wireless transceiver system for signal processing. deal with. For example, the active phased array radar can receive signals through the antenna, and then amplify, phase shift and attenuate the signals received by the antenna through the tile-type TR module, and then further process the signal through the processing unit of the active phased array radar. Processing, in order to realize the signal analysis and target positioning functions ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P3/00H01P3/08H01P3/10H01P5/08
CPCH01P3/00H01P3/081H01P3/10H01P5/085
Inventor 冯志强李灿郑宗贵刘玉文饶颖王首臻盛兵罗烜
Owner 中国人民解放军火箭军研究院