Defect management method and device

A defect management and defect technology, applied in the fields of electrical digital data processing, instruments, computing, etc., can solve problems such as inability to analyze and repair in depth, and achieve the effect of reducing the number of defects and facilitating control and management.

Inactive Publication Date: 2017-12-15
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a defect management method and equipment, which can solve the problem in the related art that software development cannot deeply analyze and repair defects

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Defect management method and device
  • Defect management method and device
  • Defect management method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

[0039] The inventor of the present application combines the experience of related technologies in project development, and proposes a defect management method for the pain points of insufficient effective defect information, slow defect repair, long cycle, high repeated opening rate, and insufficient follow-up analysis of defects, which mainly consists of three parts Composition: defect template, defect workflow and defect analysis plan. The implementation of this method is as follows figure 1 As shown, it mainly includes the following steps:

[0040] Step 100, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a defect management method and device, and relates to the software defect management technology. The defect management method comprises the steps of extracting defect information from a pre-configured defect template; determining the defect state according to the extracted defect information within the defect life cycle; exporting the defect information with the defect state being the determined defect from the defect template, and performing multi-dimensional defect analysis.

Description

technical field [0001] The invention relates to software defect management, in particular to a defect management scheme. Background technique [0002] In the process of software project development, defect management is an inevitable link. No project or individual can guarantee that the software they develop is free from any defects. After a defect occurs, how to analyze it in depth, repair it quickly, and provide appropriate guidance for subsequent development and delivery is a field of software development. topic of ongoing discussion. Contents of the invention [0003] The invention provides a defect management method and equipment, which can solve the problem in the related art that software development cannot deeply analyze and repair defects. [0004] In order to solve the above technical problems, the present invention discloses a defect management method, including: [0005] Extract defect information from pre-configured defect templates; [0006] Determine the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/36
CPCG06F11/3672
Inventor 荆帅帅
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap