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Metal chemical equipment for the end face of a tubular component

A component and tooling technology, which is applied in the field of solid-state power transceiver integrated device preparation, can solve problems such as no solution, and achieve the effects of improving efficiency, low price, and not easy to fall off

Active Publication Date: 2019-05-07
NORTH ELECTRON RES INST ANHUI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Evaporation process is a commonly used end metallization method, but at present, there is no way to achieve metallization by evaporation process for small-sized tubular components

Method used

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  • Metal chemical equipment for the end face of a tubular component
  • Metal chemical equipment for the end face of a tubular component
  • Metal chemical equipment for the end face of a tubular component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The invention provides a metal chemical equipment for the end face of a tubular component, including:

[0023] a. Buried tooling,

[0024] combine figure 1 and figure 2 As shown, the buried tooling includes a bearing base 1, a molded part 2, a component bearing column 3 and a stamping mass 4. The bearing base 1 is respectively provided with crossing transverse bearing grooves 1a and longitudinal bearing grooves 1b, and the depth of the transverse bearing grooves 1a is greater than The depth of the longitudinal bearing groove 1b; the molding 2 is a cuboid, and the center of the molding 2 is provided with a molding hole 2a; the molding 2 can form an assembly with the bearing base 1 through the transverse bearing groove 1a, and can also be assembled with the bearing Base 1 forms a mate; combined image 3 and Figure 4 As shown, when not in use, the molded part 2 can be assembled in the transverse bearing groove 1a. When in use, the molded part 2 is lifted and rotated ...

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PUM

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Abstract

The invention discloses a tubular component end surface metallizing tooling which comprises a burying tooling body and an evaporation tooling body. The burying tooling body comprises a bearing base, aforming piece, a component bearing column and a stamping mass block. The forming piece can be matched with the bearing base. A forming hole is formed in the center of the forming piece. The componentbearing column can be matched with the forming hole. The top surface of the component bearing column is used for holding a tubular component. After the component bearing column is placed into the forming hole, the top surface of the component bearing column and the forming hole define a medium forming cavity used for being filled with NaCl. A wafer formed by the NaCl and the tubular component ismanufactured through the burying tooling body, the evaporation tooling body is used for fixing the wafer, and then the end surfaces of the tubular component can be metallized through an evaporation process; the NaCl is low in cost, the NaCl and the tubular component can form the wafer easily, and the tubular component can be taken out only after the NaCl is dissolved after metallization is completed; and the tubular component end surface metallizing tooling provided by the invention can be used for metallizing tubular components on a large scale, and the efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of preparation of solid-state power transceiver integrated devices, in particular to the metallization of the end faces of tubular components. Background technique [0002] Small-sized tubular components (≤150μm) are the key components in the die preparation of solid-state power transceiver integrated devices, and they are the key and core components necessary for many products. In recent years, a lot of system development work has been carried out. Driven by research and development needs, carry out the research and development of dies, devices, integrated functional units and integrated devices, make breakthroughs in die and monolithic integrated circuit preparation technologies, solid-state power amplifiers, manufacturing technologies, etc., and promote the leapfrog development of technology applications and equipment. Major breakthroughs in core products and key technologies have been achieved, which is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/30C23C14/26C23C14/14C23C14/50
Inventor 张帅陈计学赵建强张乐银姜楠
Owner NORTH ELECTRON RES INST ANHUI CO LTD