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Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a wafer

A wafer box and protection board technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of particle or chemical pollution, cost increase, etc., to avoid the increase of transportation volume, reduce vibration, avoid The effect of ionic impurities

Active Publication Date: 2018-02-06
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Therefore, in conventional shipping, wafer cassettes filled with foam wafers may present a risk of particulate or chemical contamination and increased costs

Method used

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  • Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a wafer
  • Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a wafer
  • Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a wafer

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Embodiment Construction

[0076] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof and in which are shown for purposes of explanation specific embodiments in which the invention may be practiced. In this regard, directional terms such as "upper", "lower", "front", "rear", "forward", "rearward", etc. are used with reference to the orientation of the figures being described. Because components of the embodiments can be positioned in a number of different orientations, this directional terminology is used for explanation and not in any way of limitation. Obviously, other embodiments can be used and structural or logical changes can be made without departing from the scope of protection of the present invention. It is obvious that the features of the different exemplary embodiments described here can be combined with each other unless otherwise stated otherwise. Accordingly, the following detailed description should not be read in a limiting se...

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PUM

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Abstract

Various embodiments provide a wafer box, a method for arranging wafers in the wafer box, a wafer protection plate and a method for protecting a wafer. The wafer box may include a housing with a receiving space for receiving at least one wafer arranged above a housing base, at least one fixing structure which is connected to the housing base and which extends from the housing base, and at least onefixing device which is fastenable to the at least one fixing structure at a variable distance from the housing base. The fixing device and the fixing structure are designed such that the at least onewafer for arrangement in the receiving space can be fixed in a position by means of the at least one fixing device fastened to the fixing structure.

Description

technical field [0001] The present invention relates to a wafer cassette, a method for arranging wafers in the wafer cassette, a wafer protection plate and a method for protecting wafers. Background technique [0002] After the sawn wafer, or generally a flexible carrier film, such as a sawn film, optionally separated into individual chips and arranged on a wafer frame Wafers on the wafer can cause damage in the wafers when they are transported in conventional wafer transport containers (also known as wafer cassettes or multi-frame carriers). [0003] The damage can be caused, for example, by touching. In this case, for example organic and / or inorganic contamination of the wafer surface, for example due to handling during transport, can lead to electrical faults or bonding problems. Inorganic contaminants such as ions may also lead to yield loss (also called yield loss), among other consequences. Another risk point due to touching on the wafer can be scratches or indenta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
CPCH01L21/67333H01L21/67303H01L21/67386H01L21/67346H01L21/6773H01L21/67769H01L21/67772H01L21/67781H01L21/6836
Inventor M·门格尔A·尼德霍费尔H·塔梅N·文格尔
Owner INFINEON TECH AG