An electrode silver paste packaging structure applied to sensors

Abstract

The invention discloses an electrode silver paste packaging structure applied to a sensor. The structure comprises a sensor substrate, a wiring part is arranged on the sensor substrate, four front-surface wiring grooves which are evenly distributed at intervals are formed in the front surface of the wiring part of the sensor substrate, and all the front-surface wiring grooves extend in the straight line and form openings toward the insertion sides of copper wires respectively; four back-surface wiring grooves which are evenly distributed at intervals are formed on the back surface of the wiring part of the sensor substrate, and all the back-surface wiring grooves extend in the straight line and form openings toward the insertion sides of the copper wires respectively; the front-surface wiring grooves and the back-surface wiring grooves are filled with weldable silver paste respectively, the copper wires are inserted and embedded in the front-surface wiring grooves and the back-surfacewiring grooves respectively, the copper wires are welded to the weldable silver paste in the corresponding front-surface wiring grooves and the back-surface wiring grooves respectively, and the openings of the front-surface wiring grooves and the back-surface wiring grooves are filled with packaging layers which package the copper wires respectively. The electrode silver paste packaging structureapplied to the sensor has the advantages that the design is novel, the connection reliability is good, and the contact thermal resistance can be effectively lowered.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to an electrode silver paste packaging structure applied to sensors. Background technique [0002] With the continuous improvement of the level of intelligence and the continuous promotion and application of smart technologies, various sensors are widely used in smart devices, such as smart home appliances, smart testing equipment, and automated production equipment. [0003] It needs to be further explained that for existing sensors, a U-shaped clamp or ring clamp is generally used to clamp two pieces of ceramics, and the electrode terminals are electrically connected to the copper wire through point contact; however, for point contact In the case of vibration, it is easy to have problems of poor contact and unreliable connection. Contents of the invention [0004] The object of the present invention is to provide an electrode silver paste packaging structure applied to sensors ...

AI Technical Summary

Problems solved by technology

[0003] It needs to be further explained that for existing sensors, a U-shaped clamp or ring clamp is generally used to clamp two pieces of ceramics, and the electrode terminals are electrically connected to the copper wire through point contact; however, for point contact In the case of vibration, it is easy to have poor contact and unreliable connection.

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