Silicon rod feeding device for diamond wire silicon wafer cutting

Abstract

The invention discloses a diamond wire silicon wafer cutting silicon rod feeding device which can realize mechanical silicon rod transportation, glue brushing and frosted glass bonding. The diamond wire silicon wafer cutting silicon rod feeding device comprises a silicon rod transporting device, a silicon rod glue rolling device, a frosted glass discharging device, a rolling pressing device and guide rails; the transportation of a silicon rod on the guide rails is realized through the silicon rod transporting device; glue coating of the silicon rod is realized through the silicon rod glue rolling device; the discharging of frosted glass is realized through the frosted glass discharging device; the frosted glass is compressed on the silicon rod through the rolling pressing device, so that frosted glass can be bonded to the silicon rod mechanically and automatically; and by adopting the diamond wire silicon wafer cutting silicon rod feeding device, the efficiency of bonding the frosted glass to the silicon rod is improved, the production efficiency is improved, manpower input is reduced, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of diamond wire cutting of silicon wafers, in particular to a silicon rod feeding device for diamond wire silicon wafer cutting. Background technique [0002] We all know that silicon wafers are the main raw material for solar cell production and even in the field of photovoltaics. The quality of silicon wafer cutting process directly affects the conversion efficiency of solar cells. The photovoltaic market is constantly developing, and the silicon wafer cutting process is also constantly improving. From the traditional saw blade and grinding wheel cutting technology at the beginning, it has developed into wire cutting technology. A high-speed moving steel wire drives the cutting blade attached to the steel wire to rub against the silicon rod to achieve the cutting effect. However, this traditional wire cutting needs to be effectively cut under the action of cutting fluid and silicon carbide. This cutting process ...

AI Technical Summary

Problems solved by technology

[0003] In the process of cutting silicon rods into silicon wafers, it is first necessary to bond frosted glass on the silicon rods. The traditional bonding method is to manually brush the glue, and then manually bond the frosted glass to the silicon rods, so that resulting in lower efficiency and higher production costs

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