Diamond wire silicon wafer cutting process

A technology of silicon wafer cutting and diamond wire, which is applied in the direction of manufacturing tools, work accessories, stone processing equipment, etc., can solve the problems of high cost of silicon wafer cutting, long cutting time, and waste cutting fluid, so as to facilitate automatic cutting and improve efficiency , the effect of reducing production costs

Active Publication Date: 2019-06-04
LESHAN TOPRAYCELL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this traditional wire cutting needs to be effectively cut under the action of cutting fluid and silicon carbide.
This cutting process takes a long time to cut, and also produces waste mortar and waste cutting fluid, and the cost of silicon wafer cutting is relatively high.

Method used

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  • Diamond wire silicon wafer cutting process
  • Diamond wire silicon wafer cutting process
  • Diamond wire silicon wafer cutting process

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Experimental program
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Embodiment Construction

[0047] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0048] Such as Figure 1 to Figure 9 As shown, the diamond wire silicon wafer cutting process of the present invention comprises the following steps:

[0049] 1) Using a silicon rod feeding device to bond a resin plate on the upper surface of the silicon rod;

[0050] The silicon rod feeding device includes a silicon rod transport device 1, a silicon rod rolling device 2, a resin plate discharging device 3, a rolling device 4 and a guide rail 5;

[0051] The silicon rod transportation device 1, the silicon rod rubber rolling device 2, the resin plate discharging device 3 and the rolling device 4 are sequentially arranged from one end of the guide rail 5 to the other end;

[0052] The silicon rod transportation device 1 includes a first support platform 11 and a second support platform 12 that are slidably installed on guide rails, and a telescopic dev...

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PUM

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Abstract

The invention discloses a diamond wire cutting technology which is used for silicon wafers and can realize wire cutting of silicon rods, improve the cutting efficiency and reduce the cutting cost. Thetechnology comprises steps as follows: (1) resin plates are bonded to the upper surfaces of the silicon rods by the aid of a silicon rod feeding device; (2) after the resin plates are bonded to the silicon rods, the silicon rods are fixed on a silicon rod wire-cutting machine, and cutting metal wires adopt diamond wires; (3) then the silicon rods are cut, in the cutting process, the feeding speedranges from 0.12 mm / min to 0.32 mm / min, the linear speed of the diamond wires ranges from 640 m / min to 700 m / min, the laying tension is 21 N, the take-up tension is 20 N, the cutting temperature is 23 DEG C, and the flow of a cutting fluid is 35 HZ. With adoption of the technology, automatic cutting can be realized favorably, the cutting efficiency can be improved, and the cutting cost can be reduced.

Description

technical field [0001] The invention relates to the field of diamond wire cutting of silicon wafers, in particular to a diamond wire silicon wafer cutting process. Background technique [0002] We all know that silicon wafers are the main raw material for solar cell production and even in the field of photovoltaics. The quality of silicon wafer cutting process directly affects the conversion efficiency of solar cells. The photovoltaic market is constantly developing, and the silicon wafer cutting process is also constantly improving. From the traditional saw blade and grinding wheel cutting technology at the beginning, it has developed into wire cutting technology. A high-speed moving steel wire drives the cutting blade attached to the steel wire to rub against the silicon rod to achieve the cutting effect. However, this traditional wire cutting needs to be effectively cut under the action of cutting fluid and silicon carbide. This cutting process takes a long time to cu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/00B28D7/04
CPCB28D5/0058B28D5/0082B28D5/045
Inventor 陈五奎刘强徐文州
Owner LESHAN TOPRAYCELL
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