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A two-contact memory connector

A connector and double-contact technology, which is applied in the direction of connection, connection device parts, contact parts, etc., can solve problems such as low production efficiency, poor contact between memory sticks and DIMM slots, and easy omission of DIMM slots by installers

Active Publication Date: 2020-08-07
HUAWEI MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the number of DIMM slots is large and the existing two-installation method is used for production and assembly, installers are likely to miss some DIMM slots, and there is dust 104 or dirt 104 between the DIMM slots and the memory stick, such as figure 2 As shown, it will still lead to poor contact between memory sticks and DIMM slots, and the highest proportion of DIMM slots due to poor contact is 0.62% of the total, resulting in low production efficiency and high production equipment costs.

Method used

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  • A two-contact memory connector
  • A two-contact memory connector
  • A two-contact memory connector

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Embodiment Construction

[0030] The embodiment of the present application provides a dual-contact memory connector, which is used to enhance the connectivity between the DIMM reed and the gold finger of the memory stick, reduce the probability of poor contact between the DIMM slot and the memory stick, and improve production efficiency , to reduce equipment production costs.

[0031] In order to enable those skilled in the art to better understand the solutions of the present application, the following will describe the embodiments of the present application with reference to the drawings in the embodiments of the present application.

[0032] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and not necessarily Used to describe a specific sequence or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that ...

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Abstract

Disclosed in embodiments of the present application is a dual-contact memory connector, for use in enhancing the connectivity between a DIMM spring and the golden finger of a memory chip, lowering the probability of poor contact between a DIMM slot and the memory chip, improving production efficiency, and reducing device production costs. The connector comprises an insulated base (301), clips (302), a contact spring assembly (303), and a fixing assembly (304). The insulated base (301) is provided with a slot (305) which is used for insertion of a memory chip. The clips (302) are located at the two ends of the insulated base (301). The contact spring assembly (303) comprises a plurality of pairs of contact spring structures (306), each contact spring structure (306) is provided with two contact points, and the contact spring structures (306) are connected to the golden finger of the memory chip by means of the two contact points. The fixing assembly (304) is located at the bottom of the insulated base (301).

Description

[0001] This application claims the priority of the Chinese patent application with the application number 201711106195.8 and the title of the invention "a memory connector" submitted to the China Patent Office on November 10, 2017, the entire contents of which are incorporated by reference in this application document. It is only for the sake of concise expression, and its entire content will not be repeated in the original text in this application document. technical field [0002] The present application relates to the communication field, in particular to a double-contact memory connector. Background technique [0003] With the wide application of computers, people have higher and higher requirements for computer performance, higher and higher requirements for memory in computers, and higher and higher requirements for memory connectors for installing memory sticks. Most memory connectors adopt plug-in wave soldering technology to realize the connection with the motherboa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R12/71H01R13/24H01R13/627
CPCH01R12/71H01R13/2407H01R13/627
Inventor 陈礼平王峰颜波
Owner HUAWEI MACHINERY