A silicon film eddy current micro pressure sensor
A micro-pressure sensor, eddy current technology, applied in the direction of instruments, measuring force, measuring devices, etc., can solve the problems of low sensitivity, elastic lag, short calibration period, etc., to achieve the effect of improving accuracy
Active Publication Date: 2020-06-26
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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Problems solved by technology
This method uses the metal corrugated diaphragm as the sensitive element, but the thickness of the metal corrugated diaphragm is not easy to control, it is easy to generate residual stress and installation stress, and there is a defect of elastic hysteresis, which affects long-term stability and measurement accuracy, and the calibration period is short
In addition, there are micro-pressure sensors that use silicon piezoresistive effect to measure pressure by using the elastic modulus and piezoresistive effect of silicon. The sensitivity of this type of sensor is low, and the thickness of the diaphragm is difficult to control.
Method used
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[0022] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0023] like figure 1 As shown, the silicon film eddy current micro-pressure sensor of this embodiment includes a mounting base 1, a thin film 10 and a metal gland 5, the mounting base 1 is provided with a pressure introduction hole 16, and the gland 5 is provided with a mounting groove 17, The gland 5 is fastened on the mounting seat 1 and the mounting groove 17 is facing the pressure introduction hole 16. The film sheet 10 is installed in the mounting groove 17 and its peripheral side is clamped and fixed by the gland 5 and the mounting seat 1. The gland 5 An exciting coil 6 is arranged at the position facing the film sheet 10 for generating high-frequency excitation signals; a measuring coil 8 is arranged between the exciting coil 6 and the film sheet 10 for detecting the alternating magnetic field, and the measuring coil 8 and the exciting c...
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The invention discloses a silicon film eddy current micro-pressure sensor comprising an installing base, a thin film and a pressing cover. The installing base is provided with a pressure lead hole. The pressing cover is provided with an installing slot. The pressing cover is fastened on the installing base and the installing slot exactly faces the pressure lead hole. The thin film is installed inthe installing slot and the peripheral side of the thin film and the installing base are fixed in a clamping way through the pressing cover. The position, which exactly faces the thin film, of the pressing cover is provided with an exciting coil. A measuring coil is arranged between the exciting coil and the thin film. The silicon film eddy current micro-pressure sensor has the advantages of simple structure and accurate and reliable measurement.
Description
technical field [0001] The invention mainly relates to the technical field of pressure measurement, in particular to a silicon film eddy current micro-pressure sensor. Background technique [0002] In the current eddy current micro-pressure sensor, the sensitive diaphragm adopts a metal corrugated diaphragm. When the differential pressure acts on the metal corrugated diaphragm, the center of the diaphragm will move up and down, and the distance from the eddy current excitation coil changes, and the distance change is finally converted. for changes in electrical signals. This method uses the metal corrugated diaphragm as the sensitive element, but the thickness of the metal corrugated diaphragm is not easy to control, it is easy to generate residual stress and installation stress, and there is a defect of elastic hysteresis, which affects long-term stability and measurement accuracy, and the calibration period is short . In addition, there are micro-pressure sensors using s...
Claims
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IPC IPC(8): G01L1/22
CPCG01L1/2206
Inventor 金忠谢锋何峰龙悦
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP