Vacuum nozzle assembly
A vacuum suction nozzle and vacuum suction technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems such as increasing costs and increasing processing time, and achieve the goals of avoiding damage, increasing alignment accuracy, and avoiding chip damage Effect
Active Publication Date: 2019-03-22
INTEL PROD CHENGDU CO LTD +1
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Problems solved by technology
However, this adds cost given the price of the placement machine; it also increases processing time and requires additional operators due to the need to operate the placement machine for backfilling
Method used
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[0018] Various embodiments, features and effects of the present invention are described below mainly with reference to chips. Although various aspects of the present invention are described by taking a chip as an object, it should be understood that this is not a limitation to the technical solution of the present invention. As long as sufficient suction can be provided, the vacuum nozzle assembly and the pick-and-place tool of the embodiments of the present invention can be used to pick up any type of object, especially the object that needs to be picked up in the electronics industry and / or the optical industry, which includes but It is not limited to various integrated circuits, chips, circuit boards, semiconductors and liquid crystal panels, and corresponding effects can be obtained in corresponding fields.
[0019] figure 1 It is an internal structure diagram of a non-contact vacuum suction generating device 10. figure 2 A perspective view showing air flow flowing insi...
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The invention provides a vacuum nozzle assembly including a noncontact vacuum suction generating device for generating suction to pick up and place an object without touching the object; and a stopping mechanism connected with the noncontact vacuum suction generating device and restricting the position of the object by contacting the edge of the object when the noncontact vacuum suction generatingdevice generates suction to pick up the object. The vacuum nozzle assembly is capable of picking up and placing a chip without contacting the upper surface of the chip, and fixing the position of thechip during the picking up in order to point to the corresponding chip placement area in a tray, thereby making it possible to manually backfill the chip just by an operator. Therefore, not only a picking-up additional space is not required by the chip and no damage to the chip is generated, but also placement alignment accuracy is improved, cost and process processing time is saved, and the number of operators is decreased.
Description
technical field [0001] The present invention relates to the field of vacuum nozzles, and more particularly to vacuum nozzle assemblies for picking and placing objects for transporting objects. Background technique [0002] In the electronics industry, multiple chips placed on a tray need to be operated simultaneously during, for example, chip packaging and testing. For example, if a chip on a tray is found to be defective through manual visual inspection, the chip needs to be removed from the tray, and a good chip should be backfilled to the corresponding position in the tray for subsequent streamlining and standardization. [0003] On the one hand, it is possible to manually remove defective chips, but since chips are becoming increasingly thinner and miniaturized, operators may touch the upper surface of the chip by directly refilling the intact chip by hand, which is easy to damage the chip. Manual backfilling of chips into position on the tray can be inaccurate and furt...
Claims
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IPC IPC(8): H01L21/683H01L21/68
CPCH01L21/68H01L21/6838
Inventor 饶桦强毛辉寒
Owner INTEL PROD CHENGDU CO LTD