Chip-on-film package structure

Abstract

The invention provides a chip-on-film package structure. The chip-on-film package structure comprises a flexible main circuit carrier, a chip and at least one flexible secondary circuit carrier. The flexible main circuit carrier includes a flexible main substrate including a chip bonding area, and the main circuit structure includes a plurality of first pins extending to two long sides of the flexible main substrate from the chip bonding area, a plurality of second pins, and a plurality of third pins extending to at least one short side of the flexible main substrate from the chip bonding area. The chip is disposed in the chip bonding region, and is electrically connected to the first pins, the second pins, and the third pins. At least one flexible secondary circuit carrier is disposed onat least one short side of the flexible main substrate, and includes a plurality of fourth pins electrically connected to the third pins respectively to provide more flexible wiring space.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to a film-on-chip packaging structure. Background technique [0002] With the continuous evolution of electronic technology, the integrated circuit components produced are thinner, thinner and smaller, with complex functions, high I / O count, high frequency and diversification. Under this development trend, chip on film (COF) packaging meets its packaging requirements. Thin film chip-on-chip packaging is a packaging technology in which the chip is bonded to the pins on the flexible circuit substrate through conductive bumps. Compared with the traditionally used printed circuit boards, the film-on-chip packaging is to directly install the driving integrated circuit and its electronic components on the film, so that the packaging structure can be lighter, thinner, shorter and more flexible. [0003] In the circuit structure of the current flexible circuit carrier, the pins mostly ...

AI Technical Summary

Problems solved by technology

Since the pins on the flexible circuit carrier do not extend to the opposite short sides of the flexible circuit carrier, and the short sides of the chip are not provided with bumps or the provided bumps are only connected to dummy leads. Therefore, the short side of the flexible circuit carrier and the bumps on the short side of the chip have not been effectively utilized

In addition, with the increase in the density of integrated circuits, the demand for the number of pins on the flexible circuit board is also increasing, and the current widely used flexible circuit boards are all of a specific width, for example: 35 mm ( mm), 48 mm or 70 mm, the pins extending to the opposite long sides of the flexible circuit carrier are limited by the width and pin spacing of the flexible circuit carrier, and the demand for continuously increasing the number of pins faces a bottleneck. Elasticity is also limited

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