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Method and apparatus for determining the height of a barrier layer on a burn-in plate

A technology of barrier layer and height, which is applied in the field of semiconductor chip packaging and testing, can solve problems such as insufficient contact, large fluctuation range of barrier layer, easy damage of tin foil, etc., and achieve the effect of preventing overpressure and underpressure

Active Publication Date: 2019-03-05
INTEL PROD CHENGDU CO LTD +1
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Problems solved by technology

In this solution, the height of the barrier layer is calculated based on the height of all electronic components on the burn-in board. Since the height of electronic components usually has a positive / negative tolerance during manufacture, the height of the barrier layer exists. Large fluctuation range, which can lead to overpressure or underpressure situations
In the case of overpressure, the tin foil of the airbag is easily damaged; and in the case of underpressure, the heat dissipation effect is not good due to insufficient contact

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  • Method and apparatus for determining the height of a barrier layer on a burn-in plate
  • Method and apparatus for determining the height of a barrier layer on a burn-in plate
  • Method and apparatus for determining the height of a barrier layer on a burn-in plate

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[0025] The subject matter described herein will now be discussed with reference to example implementations. It should be understood that the discussion of these implementations is only to enable those skilled in the art to better understand and realize the subject matter described herein, and is not intended to limit the protection scope, applicability or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as needed. For example, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with respect to some examples may also be combined in other examples.

[0026] As used herein, the term "comprising" and its variants represent open terms meaning "including but not limited to". The...

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Abstract

The application provides a method for determining the height of a barrier layer on a burn-in board. The method comprises: a pressure sensor is arranged in a test slot of a 3D burn-in board model of aburn-in board; the pressure sensor is used for sensing a pressure value applied to the burn-in board model on the condition of air bag expansion in a heat dissipation board; and on the basis of the sensed pressure value and a correspondence relationship between a predetermined pressure value and a barrier layer height, the height of the barrier layer is determined. With the method provided by theapplication, the height of the barrier layer on the burn-in board can be easily and accurately determined.

Description

technical field [0001] The present application generally relates to the field of packaging and testing of semiconductor chips, and more specifically, relates to a method and device for determining the height of a barrier layer on a burn-in board. Background technique [0002] When semiconductor chips are packaged and tested, it is necessary to perform a burn-in process on the semiconductor chips. Specifically, the semiconductor chip is placed on a burn-in board (multi-layer burn-in board), and the entire burn-in board is placed in an electric heating box for testing at high temperature and high pressure. This high-temperature environment exceeds the normal use conditions of ordinary chips. , With this method, semiconductor testing manufacturers can test chips with unqualified performance. [0003] When performing the above-mentioned high temperature and high pressure tests, heat dissipation problems usually arise. Once the heat is not well dissipated, it is easy to cause d...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B21/08G01L5/00
CPCG01B21/08G01L5/00
Inventor 于天
Owner INTEL PROD CHENGDU CO LTD
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