IBC solar cell and preparation method of the same

A solar cell and cell technology, applied in the field of solar cells, can solve the problems of cell damage, reduce battery electrical performance, increase cost, etc., and achieve the effects of reducing short-circuit current, increasing open-circuit voltage, and increasing open-circuit voltage

Active Publication Date: 2018-07-10
YINGLI ENERGY CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this technology requires additional laser equipment for slicing, which increases the cost of additional processes and equipment, and the laser cutting process itself will bring additional damage to the battery sheet and reduce the electrical performance of the battery.

Method used

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  • IBC solar cell and preparation method of the same
  • IBC solar cell and preparation method of the same
  • IBC solar cell and preparation method of the same

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Embodiment Construction

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0038] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or...

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Abstract

The invention provides an IBC (Interdigitated back contact) solar cell and a preparation method of the same, and belongs to the solar cell field. The IBC solar cell is characterized in that an ICB cell is equally divided into even number of same cell units through laser scribing lines, and the adjacent cell units are insulated from each other; printing of insulated slurry is performed along the solder strip connection positions, so as to enable a plurality of solder strips to connect P type metalized grid lines and N type metalized grid lines in the horizontal direction successively at intervals; and each of the plurality of solder strips is connected with the anode and the cathode of the adjacent cell units in the vertical direction, so that one continuous solder strip can connect each cell unit in series. Therefore, for the IBC solar cell, on the premise of not changing the cells, the assembly equipment and the technology, the effect of improving open-circuit voltage and reducing short circuit current can be obtained, so that during the assembly packaging process, the open-circuit voltage can be increased and the short circuit current can be reduced, and then the packaging loss caused by the current and the resistance can be reduced.

Description

technical field [0001] The invention belongs to the technical field of solar cells, and more specifically relates to an IBC solar cell and a preparation method thereof. Background technique [0002] IBC solar cell: IBC (Interdigitated back contact), full back electrode contact crystalline silicon solar cell, referred to as "IBC cell", a back contact solar cell, the positive and negative metal electrodes are interdigitated on the non-light-receiving surface of the cell. [0003] N-type solar cells: The substrate of silicon wafers of solar cells is silicon wafers doped with boron. [0004] Emitter: the pn junction, a pn junction is formed on the silicon substrate through high temperature diffusion, and phosphorus is diffused on the emitter of the N-type battery. [0005] SiNx: Silicon nitride, generally forms a silicon nitride layer on the surface of the silicon wafer by PECVD (plasma enhanced vapor phase chemical deposition method), fills the dangling bonds on the surface of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/068H01L31/0224H01L31/05H01L31/18
CPCH01L31/022433H01L31/022441H01L31/0516H01L31/0682H01L31/1804Y02E10/547Y02P70/50
Inventor 王子谦刘大伟翟金叶张伟孟庆超沈艳娇李锋张建旗
Owner YINGLI ENERGY CHINA
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