BGA Solder Ball Contour Extraction Method Based on Transformation in X-ray Image

A contour extraction and image-based technology, applied in the field of computer software automation, can solve the problems of data subjectivity enhancement, etc., and achieve the effect of enhancing image recognition rate and high adaptability

Active Publication Date: 2020-06-26
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, these methods are all dependent on parameters. The adjustment of parameters directly determines the quality of the processing effect, and the use of parameters will increase the subjectivity of data.

Method used

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  • BGA Solder Ball Contour Extraction Method Based on Transformation in X-ray Image
  • BGA Solder Ball Contour Extraction Method Based on Transformation in X-ray Image
  • BGA Solder Ball Contour Extraction Method Based on Transformation in X-ray Image

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Embodiment Construction

[0055] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0056] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and It is not to indicate or imply that the device or element referred to ...

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Abstract

The present invention proposes a method for extracting the contours of BGA solder balls based on transformed X-ray images, which includes the following steps: S1, obtaining the original image of the solder joint, performing circle detection on the original image, obtaining the solder joint image, and performing a circle detection on each solder joint Solder balls are initially identified to obtain the ROI of each solder joint; S2, transform the original image, and after obtaining the target image, perform edge detection on the target image; S3, map the detection result back to the original coordinate system to obtain the mask image, and use The mask processing is performed on the original image to extract a single solder joint image; the edge extraction is performed on the mask image to extract the solder joint outline image.

Description

technical field [0001] The invention relates to the field of computer software automation, in particular to a method for extracting the outline of BGA solder balls in X-ray images based on transformation. Background technique [0002] In the prior art, there are mainly three methods for extracting the outline of BGA solder joints on the PCB: [0003] 1. After preprocessing such as noise reduction, perform threshold segmentation to extract BGA solder joints; [0004] 2. Use the flood method to gradually fill the image and the improved "scan line-based seed filling method" to obtain BGA solder joints; [0005] 3. Use Canny and other edge detection methods to identify the edge of the solder joint, so as to obtain the solder ball target. [0006] The first method only uses the grayscale information of the digital image, which requires high grayscale interference and image quality, and is susceptible to interference from internal air bubbles and external wires; the second metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/13G06T7/12G06T7/00G06K9/46G06K9/32
CPCG06T7/0004G06T7/12G06T7/13G06T2207/10116G06T2207/30152G06V10/48G06V10/25
Inventor 方黎勇李井元
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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