Metal substrate functional part and additional material processing preparation method thereof

Abstract

The invention discloses a metal substrate functional part and an additional material processing preparation method thereof. An aluminum alloy layer, an aluminum-iron alloy layer and an aluminum ceramic layer are arranged, the aluminum-iron alloy layer comprises a plurality of aluminum-iron alloy sublayers, and the content of iron of each aluminum-iron alloy sublayer is increased layer by layer inthe direction from the aluminum alloy layer to the aluminum ceramic layer, so that the aluminum alloy end is continuously in transition to the aluminum-iron alloy layer and to the aluminum ceramic layer finally, the finally formed metal substrate functional part not only has the good properties of the aluminum alloy, for example, corrosion resistance, abrasion resistance, good thermal conductivityand low weight, but also has the good heat resistance, high temperature resistance, high mechanical strength, high-temperature oxidation resistance and other properties, and at the same time, as an intermediate layer is composed of the cheap aluminum-iron alloy layer with high toughness, the whole cost is reduced effectively.

Description

technical field [0001] The invention relates to the technical field of composite materials and their processing, and more specifically, to a metal substrate functional part and a preparation method for additive processing thereof. Background technique [0002] Traditional composite materials are composed of two or more homogeneous materials with different properties, and have been widely used in engineering. However, due to the sudden change of the physical parameters of the materials at the interface junction, a large stress is easily generated at the material interface. Make the material deform and crack at the interface to fail. For example, in terms of advanced insulation materials for aerospace vehicles, the traditionally used metal and ceramic composite material dispersion-strengthened ceramics, due to the large difference in thermal expansion coefficient between the two, the interface is easily cracked and peeled off due to thermal stress, and cannot be used in extrem...

AI Technical Summary

Problems solved by technology

However, these methods for preparing gradient materials have various deficiencies, such as high porosity, poor interlayer bonding, low strength, high energy consumption and low efficiency, small size of gradient materials, and More or less there are interfaces, components cannot be continuously and smoothly distributed, etc.

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