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Pressure-sensitive flexible circuit board and manufacturing method thereof

A flexible circuit board, pressure-sensitive flexible technology, applied in the direction of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of not being able to realize multi-touch, difficult to change into an array and integrate into a surface, etc., to achieve Achieve multi-touch and avoid the effect of lead design

Active Publication Date: 2020-04-14
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The resistance pressure-sensing sheet in the mechanical sensor in the prior art needs to pull the lead wire at the end of the sensitive grid of the resistance pressure-sensing sheet, and because the above-mentioned lead wire needs to be pulled out of the virtual space, so the resistance pressure-sensing sheet in the prior art It is difficult for a chip to change from a single component to an array and integrate it into an application, that is, it cannot realize multi-touch

Method used

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  • Pressure-sensitive flexible circuit board and manufacturing method thereof
  • Pressure-sensitive flexible circuit board and manufacturing method thereof
  • Pressure-sensitive flexible circuit board and manufacturing method thereof

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Embodiment Construction

[0015] In order to further illustrate the technical means and effects that the present invention takes to reach the intended purpose of the invention, the following in conjunction with the appended Figure 1-5 And the preferred implementation mode, the specific implementation, structure, features and effects of the pressure-sensitive flexible circuit board and its manufacturing method provided by the present invention are described in detail as follows.

[0016] Please refer to Figure 1-3 , the first embodiment of the present invention provides a pressure-sensitive flexible circuit board 100 , the pressure-sensitive flexible circuit board 100 is composed of a plurality of resistive pressure-sensitive chip modules 110 arranged in an array.

[0017] Each resistance-sensing chip module 110 includes at least one resistance-sensing chip 10 .

[0018] see figure 2 , in this embodiment, each of the resistor-sensing chip modules 110 includes one resistor-sensing chip 10 .

[0019...

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Abstract

The invention provides a pressure-sensing flexible circuit board. The pressure-sensing flexible circuit board comprises a plurality of resistance pressure-sensing sheet modules; each resistance pressure-sensing sheet module comprises at least one resistance pressure-sensing sheet; each resistance pressure-sensing sheet comprises a substrate layer, a strain metal line layer and a signal transmission line layer, and the strain metal line layer and the signal transmission line layer are positioned on two opposite surfaces of the substrate layer; the plurality of resistance pressure-sensing sheetmodules are arranged in an array; and each resistance pressure-sensing sheet also comprises a pair of conductive blind holes, and the pair of conductive blind holes are electrically connected with thestrain metal line layer and the signal transmission line layer. The invention also relates to a preparation method of the pressure-sensing flexible circuit board.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a flexible circuit board containing a reinforcing sheet. Background technique [0002] The resistance pressure-sensing sheet in the mechanical sensor in the prior art needs to pull the lead wire at the end of the sensitive grid of the resistance pressure-sensing sheet, and because the above-mentioned lead wire needs to be pulled out of the virtual space, so the resistance pressure-sensing sheet in the prior art It is difficult for a chip to change from a single element to an array and integrate it into an application, that is, it cannot realize multi-touch. Contents of the invention [0003] In view of this, the present invention provides a pressure-sensitive flexible circuit board capable of realizing multi-touch and integrated surface and a manufacturing method thereof. [0004] A pressure-sensitive flexible circuit board, comprising a plurality of resistance-sensing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/42
CPCH05K1/115H05K1/118H05K3/42H05K2201/09509
Inventor 胡先钦沈芾云许芳波何明展徐筱婷王威
Owner AVARY HLDG (SHENZHEN) CO LTD