Flexible substrate fixing method and flexible substrate

A technology of flexible substrates and fixing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of defective products, low efficiency, waste of substrates, etc., and achieve the effect of convenient operation

Inactive Publication Date: 2018-08-17
湖南晶讯光电股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a method is inefficient, easy to attach unevenly, and produces defective products. The cost of equipment transformation is too high, and it is not convenient for later separation and treatment, resulting in waste of substrates and high costs.

Method used

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  • Flexible substrate fixing method and flexible substrate
  • Flexible substrate fixing method and flexible substrate

Examples

Experimental program
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Effect test

Embodiment 1

[0028] Such as figure 1 As shown, the present embodiment provides a flexible substrate fixing method, which includes the following steps:

[0029] Step 1. Select a carrier substrate that is convenient for the subsequent processing of the flexible substrate 3;

[0030] Step 2. Apply a layer of temperature-control glue 2 evenly on the carrier substrate;

[0031] Step 3: heating the carrying substrate to make the temperature-controlled glue 2 viscous, and attaching the flexible substrate 3 to the carrying substrate;

[0032] Step 4: Continue the heat treatment until the flexible base material 3 is bonded to the carrier substrate to obtain a fixed flexible base material 3 .

[0033] This embodiment provides a flexible substrate 3 fixing method that is easy to operate and can be mass-produced automatically, which can solve the mass production of flexible devices without modifying existing equipment, and at the same time improve the processing efficiency of flexible devices and sa...

Embodiment 2

[0044] On the basis of Embodiment 1, this embodiment further provides a flexible substrate, which includes a glass substrate 1, a flexible substrate 3, and a temperature-controlled glue 2 arranged between them, and adopts the method described in Embodiment 1. The flexible base material 3 fixing methods are fixed into one body, such as figure 2 shown.

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Abstract

The invention provides a flexible substrate fixing method. The flexible substrate fixing method comprises the following steps of selecting a bearing substrate which is convenient to subsequently process by a flexible substrate; uniformly coating a layer of temperature control glue on the bearing substrate; heating the bearing substrate so that the temperature control glue generates viscidity, andattaching the flexible substrate onto the bearing substrate; and continuing to perform heating processing until the flexible substrate and the bearing substrate are pasted integrally to obtain the fixed flexible substrate. The flexible substrate fixing method is convenient to operate, automatic and mass production can be achieved, the mass production of a flexible device can be solved without changing traditional equipment, the processing efficiency of the flexible device is improved, and the cost is reduced.

Description

technical field [0001] The present invention relates to the technical field of fixing flexible substrates, in particular to an applicable method for fixing flexible substrates and a flexible substrate prepared by the method. Background technique [0002] At present, in the early stage of production of known flexible display devices, flexible materials need to be pasted on hard substrates such as glass with double-sided tape or self-adhesive tape to facilitate machine assembly, or to modify the equipment to realize flexible substrates. processing. Such a method is inefficient, easy to attach unevenly, and produces defective products. The cost of equipment modification is too high, and it is not convenient for later separation and treatment, resulting in waste of substrates and high costs. [0003] For this reason, a flexible substrate fixing method that is easy to operate and can be mass-automated is provided, and a flexible substrate prepared by the method is further provid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67132
Inventor 贺术春张启威
Owner 湖南晶讯光电股份有限公司
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