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Low-heat elastic damping two-end-fixed micro-beam resonator with through hole structure

A technology of micro-beam resonator and elastic damping, which is applied in the direction of impedance network and electrical components, and can solve the problems such as difficult to change the working frequency

Inactive Publication Date: 2018-08-31
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But in many cases, the operating frequency is difficult to change, only in the low frequency band

Method used

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  • Low-heat elastic damping two-end-fixed micro-beam resonator with through hole structure
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  • Low-heat elastic damping two-end-fixed micro-beam resonator with through hole structure

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Embodiment Construction

[0022] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0023] The present invention provides a low thermoelastic damping microbeam resonator fixed at both ends with a through-hole structure. The microbeam device of the present invention adopts a narrow and long rectangular through-hole structure, which physically reduces the thickness of the beam, so that the thermoelastic damping peak appears higher The frequency band avoids the operating frequency (in the low frequency band), thereby significantly reducing thermoelastic damping, that is, significantly reducing energy loss.

[0024] The present invention as figure 1 The shown low thermoelastic damping bending vibration microbeam device with a narrow and long rectangular through-hole structure includes a base 5 , a low thermoelastic damping structure arranged on the base 5 , and a driving electrode 3 . The low thermoelastic damping structure inclu...

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Abstract

The invention relates to a low-heat elastic damping two-end-fixed micro-beam resonator with a through hole structure. The through hole structure can be an elongated rectangular through hole or a circular through hole. The device comprises a low-heat elastic damping micro beam with a through hole structure, two end fixing supports and an electrode for electrostatic excitation. The previous two end-fixing micro-beam (rectangular cross section) is of a solid structure, the thermal elastic damping peak of the solid structure is at a low frequency section, the damping peak corresponds to the maximum thermal elastic energy loss, which is completely detrimental to the micro-beam device operating in a low-frequency section. The physical principle of the low-heat elastic damping two-end-fixed micro-beam adopting a long and narrow rectangular through hole scheme provided by the invention is as follows: long and narrow rectangular holes are formed along the length direction; the number of the rectangular holes is at least two; due to hole opening, the thickness of the beam is thinned, and the thermal elastic damping peak is moved to a high-frequency section, so that the thermal elastic energyloss of the micro-beam is greatly lower than that of the original solid micro-beam device under the situation that the operation (vibration) frequency is not changed.

Description

technical field [0001] The invention relates to the field of micro-electromechanical systems (MEMS), in particular to a micro-beam resonator with a through-hole structure and a micro-beam resonator with low thermoelastic damping and fixed at both ends. Background technique [0002] The two-terminal fixed microbeam in bending vibration is the core part of many MEMS devices, such as microbeam resonators and filters. Fixed at both ends is the boundary condition of the beam, that is, the two ends of the micro-beam in the length direction are constrained and fixed without displacement. This type of microbeam is generally made of Si material, and usually requires a high quality factor, that is, requires a small damping. Thermoelastic damping (Thermoelastic damping, referred to as TED) is a very important damping of microbeam bending vibration. This damping is due to the compression and stretching of the mechanical structure under stress, resulting in a change in volume. The vol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/02H03H9/05H03H9/24
CPCH03H9/02338H03H9/0538H03H9/2405
Inventor 李普方玉明台永鹏
Owner SOUTHEAST UNIV
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