Method for manufacturing non-metallized hole without exposure of base materials at orifice of circuit board

Abstract

The invention relates to the technical field of circuit board production, and particularly relates to a method for manufacturing a non-metallized hole without the exposure of base materials at the orifice of a circuit board. According to the invention, the production process of a circuit board is optimized and adjusted. Meanwhile, a non-metallized hole and a metallized hole are manufactured separately. Moreover, the non-metallized hole is drilled after the copper deposition and whole-board electroplating process and before the chip aligning process. Due to the fact that no copper is depositedon the hole wall of the non-metallized hole, no plating layer is formed on the hole wall of the non-metallized hole during the subsequent electroplating of the copper tin. That means, the coverage ofa dry film at the orifice of the non-metallized hole is not required for an outer-layer line pattern, and the non-metallized hole cannot be metalized. However, the side wall of the bottom copper at the orifice of the non-metallized hole is exposed, so that the plating layer is formed during the electroplating of the copper tin. As a result, the side wall of the bottom copper at the orifice of thenon-metallized hole is wrapped by the tin coating, so that the orifice of the non-metallized hole can be protected from being eroded and damaged during the etching process. The problem that a substrate at the orifice of the non-metallized hole is exposed in the prior art is thoroughly solved.

Description

Technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a non-metallized hole on a circuit board with no base material exposed. Background technique [0002] The circuit board is also called a printed circuit board (PCB, Printed Circuit Board). The production of circuit boards includes two links: circuit design and manufacturing. The manufacturing of circuit boards is based on the previous circuit design. The manufacturing process is generally as follows: according to the design requirements, the inner core board is cut to the required size in the cutting process → Paste the film on the inner core board → use the inner film to align the exposure → develop and remove the uncured film to form the inner layer pattern → etch the copper layer on the inner core board that is not covered by the film to form the inner layer circuit → remove the film → Stack the inner core boards in a certain arrangement...

AI Technical Summary

Problems solved by technology

Among them, for circuit boards with metallized holes and non-metallized holes at the same time, when drilling the outer layer in the prior art, the hole positions of the metallized holes and the non-metallized holes are usually drilled together, so the follow-up can only use The outer layer circuit is made by the positive film process, which cannot be processed by the negative film process

When using the positive film process, it is necessary to seal the opening of the non-metallized hole with a dry film to avoid plating copper and tin on the hole wall during pattern plating, but because the dry film for sealing the non-metallized hole is larger than the hole, After stripping and etching, there will be a ring-shaped bare surface of the substrate at the orifice, which will affect the quality of the product

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