A method for making a non-metallized hole with no exposed base material at the hole on a circuit board
A technology of non-metallized holes and a manufacturing method, which is applied in the field of non-metallized holes and can solve problems such as inability to process negative films and affect product quality.
Active Publication Date: 2020-03-24
JIANGMEN SUNTAK CIRCUIT TECH
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- Abstract
- Description
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- Application Information
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Problems solved by technology
Among them, for circuit boards with metallized holes and non-metallized holes at the same time, when drilling the outer layer in the prior art, the hole positions of the metallized holes and the non-metallized holes are usually drilled together, so the follow-up can only use The outer layer circuit is made by the positive film process, which cannot be processed by the negative film process
When using the positive film process, it is necessary to seal the opening of the non-metallized hole with a dry film to avoid plating copper and tin on the hole wall during pattern plating, but because the dry film for sealing the non-metallized hole is larger than the hole, After stripping and etching, there will be a ring-shaped bare surface of the substrate at the orifice, which will affect the quality of the product
Method used
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Embodiment
[0019] This embodiment provides a method for fabricating a circuit board, in particular to a method for fabricating a non-metallized hole on a circuit board without an exposed base material. Specific steps are as follows:
[0020] (1) Cutting: Cut out the core board according to the panel size of 720mm×620mm, and the thickness of the core board is 0.5mm.
[0021] (2), making the inner layer circuit: transfer the inner layer graphics, coat the photosensitive film with a vertical coating machine, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) ) to complete the exposure of the inner layer circuit; inner layer etching, etch the circuit after exposure and development of the core board, the inner layer line width is measured as 3mil, and the inner layer core board is made; the inner layer AOI, and then check the open and short circuit of the inner layer circuit ,...
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The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a non-metallized hole on a circuit board with no exposed base material at the hole. In the present invention, by adjusting and optimizing the production process of circuit boards, the holes for making metallized holes and non-metallized holes are made separately, and the non-metallized holes are drilled before the positive film process after sinking copper and full-board electroplating. There is no copper sinking on the hole wall of the metallized hole, and no plating layer will be formed on the hole wall of the non-metallized hole during the subsequent electroplating of copper and tin, that is, the outer layer circuit pattern does not need to form a dry film coverage at the opening of the non-metallized hole, and the non-metallic The metallized hole will not be metallized, but because the side wall of the bottom copper at the opening of the non-metallized hole is exposed, a plating layer will be formed when copper and tin are electroplated, and the side wall of the bottom copper at the opening of the non-metallized hole is wrapped by tin plating , so that the opening of the non-metallized hole can be protected from side erosion during the etching process, and the problem of exposing the base material at the opening of the non-metallized hole in the prior art is completely solved.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a non-metallized hole on a circuit board with no exposed base material at the hole. Background technique [0002] The circuit board is also called a printed circuit board (PCB, Printed Circuit Board). The production of circuit boards includes two links of circuit design and manufacturing. The manufacture of circuit boards is based on the previous circuit design. The manufacturing process is generally as follows: according to the design requirements, the inner core board is cut into the required size in the cutting process→ Lay film on the inner core board → use the inner layer film to expose in position → develop and remove the uncured film to form the inner layer pattern → etch the copper layer not covered by the film on the inner core board to form the inner layer circuit → remove the film → Stack the inner core boards in a certain o...
Claims
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IPC IPC(8): H05K3/40
CPCH05K3/403H05K2203/1438
Inventor 张义兵潘捷杨润伍李江
Owner JIANGMEN SUNTAK CIRCUIT TECH