A method of encapsulating an LED light source

A technology of LED light source and packaging method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., and can solve problems such as broken bonding wires

Active Publication Date: 2019-09-24
厦门多彩光电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims to provide a packaging method for LED light sources to solve the problem that the bonding wires will be broken due to thermal expansion of the packaging glue in the existing LED light sources.

Method used

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  • A method of encapsulating an LED light source
  • A method of encapsulating an LED light source
  • A method of encapsulating an LED light source

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Embodiment Construction

[0022] To further illustrate the various embodiments, the present invention is provided with accompanying drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments, and can be combined with related descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should understand other possible implementations and advantages of the present invention. Components in the figures are not drawn to scale, and similar component symbols are generally used to denote similar components.

[0023] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0024] The present invention provides a packaging method for LED light source, the packaging method includes the following steps, firstly through the steps of die bonding, wire bonding and glue dispensing in the prior a...

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Abstract

The invention relates to a packaging method for an LED light source. According to the packaging method, by performing heat treatment on bonding wires of the LED light source prepared by an existing packaging process, the bonding wires are separated from an encapsulant to form cavities, so that thermal expansion of the encapsulant does not directly act on the bonding wires when the LED light sourceworks, and the bonding wires are prevented from being snapped due to thermal expansion of the encapsulant.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a method for packaging LED light sources. Background technique [0002] The life of LED light sources is closely related to the life of materials such as LED chips, packaging glue, and wires. Now that LED chip technology has matured, there are relatively few failures caused by LED chip abnormalities, and more failures are caused by wire breakage caused by the thermal expansion of the packaging colloid used for welding chips, especially in high-temperature applications. In an environment with high temperature, it is more common that the failure caused by the disconnection of the wire is caused by the thermal expansion of the encapsulation gel. [0003] In order to reduce wire breakage caused by thermal expansion of the encapsulating colloid, the existing solutions mainly have the following directions: First, the material, such as silica gel with a low expansion coefficient, but this ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/62
Inventor 高春瑞郑剑飞郑文财
Owner 厦门多彩光电子科技有限公司
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