Die sorting system to prevent mixing of copper and iron lead frames

A kind of technology with iron leads and sorting system, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., and can solve problems such as machine idling, customer complaints, and mixing

Active Publication Date: 2020-11-13
华润赛美科微电子(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the copper lead frame and the iron lead frame are equipped with separate production machines, it is easy to cause the machine to be idle and affect the production efficiency
If the copper lead frame and the iron lead frame share the same machine, it is easy to mix the lead frame of another material when using one lead frame to package the chip, causing customer complaints

Method used

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  • Die sorting system to prevent mixing of copper and iron lead frames

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Embodiment Construction

[0017] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0019] figur...

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PUM

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Abstract

The invention relates to a chip sorting system for preventing mixing of copper lead frames and iron lead frames, which comprises: a feeding device, wherein the feeding device comprises a discharging port for uniformly sending out chips packaged with lead frames from the discharging port; an auxiliary feeding device, wherein the auxiliary feeding device comprises a feeding end and a discharging end, wherein the feeding end is used for receiving the chips sent out from a discharging hole, the auxiliary feeding equipment is used for conveying the chips which enter from the feeding end to the discharging end, and the chips are adjusted in the conveying process so as to form an ordered queue; a magnet, wherein the magnet is arranged at the feeding end or the discharging end to adsorb the iron lead frames mixed in the copper lead frames when the system is sorting the chips packaged with the copper lead frames; a chip sorting device, wherein the chip sorting device is used for conveying the chips discharged from the auxiliary feeding device to a designated position. By using the magnet to adsorb the iron lead frames, the system is simple in realization and accurate and efficient.

Description

technical field [0001] The invention relates to equipment for manufacturing semiconductor devices, in particular to a chip sorting system for preventing the mixture of copper lead frame and iron lead frame. Background technique [0002] For the packaging of semiconductor devices, such as optocoupler finished products, due to cost considerations, in addition to the traditional copper lead frame, an iron lead frame will also be used. If the copper lead frame and the iron lead frame are equipped with separate production machines, it is easy to cause the machine to be idle and affect the production efficiency. If the copper lead frame and the iron lead frame share the same machine, it is easy to mix the lead frame of another material when using one lead frame to package the chip, causing customer complaints. Contents of the invention [0003] Based on this, it is necessary to provide a chip sorting system that prevents the mixture of copper lead frame and iron lead frame. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67271
Inventor 顾汉玉张建文
Owner 华润赛美科微电子(深圳)有限公司
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