Automatic anti-attachment plate dismounting and replacing mechanism

Abstract

The invention discloses an automatic anti-attachment plate dismounting and replacing mechanism. The automatic anti-attachment plate dismounting and replacing mechanism comprises a lifting plate, a lifting mechanism, a dismounting and replacing plate and a transverse movement mechanism. The lifting mechanism drives the lifting plate to ascend and descend, and the transverse movement mechanism is provided with a movable base. The dismounting and replacing plate is provided with an installing part and a splicing part, the installing part is arranged and fixed to the movable base, and the splicingpart is used for being spliced with the lifting plate. After the lifting plate and the dismounting and replacing plate are spliced, the front side work surfaces of the lifting plate and the dismounting and replacing plate are smoothly connected, and the installing part and an avoiding structure are matched. The front side surface of the lifting plate is a smooth surface, and the work surfaces ofthe dismounting and replacing plate and an extending part are provided with particle protruding structures which are evenly distributed. Since most of splashed target materials are deposited at the middle lower portion of an anti-attachment plate, after long-time usage, only the actions of the lifting mechanism and the transverse movement mechanism are needed, the lifting plate and the dismountingand replacing plate are separated, the dismounting and replacing plate is moved out to be replaced, integral dismounting, replacing and cleaning of the anti-attachment plate are not needed, materialusage is reduced, cost is reduced, and manpower is saved.

Description

technical field [0001] The invention relates to an automatic dismantling mechanism for an anti-strike plate. Background technique [0002] Vacuum sputtering is a technology that uses physical methods to vaporize material sources into gaseous molecules, atoms or ions in a vacuum environment, and deposits them on the surface of the substrate through a low-pressure gas or ion process, so that it has a special functional film; During the sputtering process, the sputtering source will sputter in random directions. In addition to attaching to the surface of the target substrate, some parts will attach to the surface of other surrounding parts. In order to protect other structural parts from attaching and depositing films, anti-sputtering The boards are covered and protected; most of the existing anti-shock boards are of one-piece structure, which need to be replaced as a whole after long-term use, and the replaced boards must be cleaned, which increases the cost and reduces the ef...

AI Technical Summary

Problems solved by technology

[0002] Vacuum sputtering is a technology that uses physical methods to vaporize material sources into gaseous molecules, atoms or ions in a vacuum environment, and deposits them on the surface of the substrate through a low-pressure gas or ion process, so that it has a special functional film; During the sputtering process, the sputtering source will sputter in random directions. In addition to attaching to the surface of the target substrate, some parts will attach to the surface of other surrounding parts. In order to protect other structural parts from attaching and depositing films, anti-sputtering Covering and protection of the board; most of the existing anti-shock boards are of one-piece structure, which need to be replaced as a whole after a long time of use, and the replaced board should be cleaned, which increases the cost and reduces the efficiency

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