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LED Chip and manufacture method thereof

A technology of LED chips and manufacturing methods, which is applied to electrical components, circuits, semiconductor devices, etc., and can solve problems such as cumbersome LED chip manufacturing processes

Inactive Publication Date: 2018-11-13
YANGZHOU CHANGELIGHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the above problems, the present invention provides an LED chip and a manufacturing method, which solves the problem of cumbersome LED chip manufacturing processes in the prior art

Method used

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  • LED Chip and manufacture method thereof
  • LED Chip and manufacture method thereof
  • LED Chip and manufacture method thereof

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0042] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0043] figure 1 It is a schematic flowchart of a method for manufacturing an LED chip provided by an embodiment of the present invention, and the method includes:

[0044] S101: Provide a first substrate and a se...

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Abstract

The invention discloses a manufacture method of an LED chip, comprising: providing a first substrate and a second substrate; forming a photoresist film layer on the first substrate, wherein the photoresist film layer includes a plurality of slots that run through the photoresist film layer; forming a first metal layer in the slots, and removing the photoresist film layer; forming an epitaxial layer on the second substrate; forming a second metal layer on the side, far away from the second substrate, of the epitaxial layer; bonding the first metal layer and the second metal layer; removing thesecond substrate. The manufacture method helps solve the problem of the prior art that LED chip manufacture steps are complex.

Description

technical field [0001] The present invention relates to the technical field of manufacturing LED chips, and more specifically, relates to an LED chip and a manufacturing method thereof. Background technique [0002] With the continuous development of science and technology, various LED chips have been widely used in people's daily life, work and industry, bringing great convenience to people's life. [0003] Light Emitting Diode (LED) has many advantages such as high efficiency, low energy consumption, long life, no pollution, small size, rich colors, etc., and is widely used in lighting, display, backlight and other fields. [0004] However, in the current flip-chip process, the operation time of the process is long and complicated, which will result in high chip cost; at the same time, the risk of abnormal occurrence (such as artificial fragmentation, machine fragmentation, scratches and rework, etc.), resulting in low chip yield. [0005] Then, how to solve the problem ...

Claims

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Application Information

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IPC IPC(8): H01L33/00
CPCH01L33/0093
Inventor 曹广亮贾钊赵炆兼郭冠军温晓润
Owner YANGZHOU CHANGELIGHT