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Method for manufacturing conductive film layer

A manufacturing method and a conductive film layer technology, which are applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems that the development cost of etching solution cannot be effectively reduced, and it is difficult to find etching solution for etching, so as to save manufacturing cost and reduce Resistance value, the effect of improving manufacturing yield

Inactive Publication Date: 2009-11-04
CHUNGHWA PICTURE TUBES LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in actual production, it is difficult to find a suitable etching solution to etch copper and nickel at the same time, so the development cost of etching solution cannot be effectively reduced

Method used

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  • Method for manufacturing conductive film layer
  • Method for manufacturing conductive film layer
  • Method for manufacturing conductive film layer

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Experimental program
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Embodiment Construction

[0019] Figure 1A ~ Figure 1C It is a schematic cross-sectional flow diagram of the manufacturing method of the conductive film layer of the present invention. Please refer to Figure 1A Firstly, a substrate 110 is provided, and a patterned adhesion layer 120 is formed on the substrate 110 . Of course, those with ordinary knowledge in the technical field should know Figure 1A The pattern of the patterned adhesive layer 120 shown in FIG. 2 can be appropriately adjusted according to actual needs, and is only used for illustration and not intended to be limiting.

[0020] Figure 2A ~ Figure 2E It is a schematic cross-sectional flow diagram of the manufacturing method of the patterned adhesive layer of the present invention. Please refer to Figure 2A In detail, the above-mentioned method for forming the patterned adhesive layer 120 includes the following steps: first, a material layer 121 is formed on the substrate 110 . Generally, the material layer 121 is mainly composed...

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Abstract

The invention discloses a method for manufacturing conductive film layer, comprising the following steps of: first of all, providing a substrate and forming a patternization bonding layer on the substrate. Then, performing an electroless plating and disposing the substrate in a plating solution, and by means of oscillating the plating solution, leading the patternization bonding layer to form a first metal layer; afterwards, carrying out a film plating to form a second metal layer on the first metal layer. The method for manufacturing conductive film layer provided by the invention can efficiently reduce manufacturing cost and promote the procedure qualified rate, and the conductive film layer is able to include excellent conducting property.

Description

technical field [0001] The invention relates to a method for manufacturing a conductive film layer, and in particular to a method for manufacturing a conductive film layer in a liquid crystal display panel. Background technique [0002] The multimedia technology in today's society is quite developed, mostly benefiting from the progress of semiconductor components and display devices. As far as displays are concerned, liquid crystal displays with superior characteristics such as high image quality, good space utilization efficiency, low power consumption, and no radiation have gradually become the mainstream of the market. Specifically, the liquid crystal display is composed of a thin film transistor array substrate, a color filter substrate and a liquid crystal layer sandwiched between the two substrates. Wherein, the thin film transistor array substrate is mainly composed of a plurality of thin film transistors and related peripheral circuits. In actual production, the ga...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/28H01L21/283H01L21/768G02F1/1343G02F1/1362
Inventor 邱羡坤赖钦诠林宜平杨淑贞
Owner CHUNGHWA PICTURE TUBES LTD