The invention discloses a method for preparing a film surface with nanometer thickness on the surface of copper, the method comprises V1ing, a substrate of the copper is pretreated. V2ing, chemical pure (NH4)2TIF6 and analytically pure boric acid are respectively prepared into uniform solution, and the two solution are equably mixed. V3ing, prepared sedimentary solution is heated in water bath, after the temperature of the sedimentary solution is constant, the substrate of the copper is vertically put into the solution, the film begins to be prepared until reaches to a predetermined thickness. V4ing, the substrate is removed, and residues on the surface are removed. V5ing, the substrate is naturally dried in room temperature, and then is put in a heating device to heat, after being naturally cooled, a uniform compact titanium oxide film surface is obtained. Because the method of the invention uses a unique pretreatment method, the film on the surface of the prepared copper is uniform and compact, has the nanometer thickness, is capable of effectively reducing the surface energy of a heat transfer surface, fouling in a heat interchanger not easy to adhere on the surface, thereby playing a certain effect of preventing and removing scale.