Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium

A technology for printed circuit boards and heat conduction medium, applied in the directions of printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of reducing the integrity rate of components, environmental pollution, low heat utilization efficiency, etc. The effect of high friendliness and high energy efficiency

Inactive Publication Date: 2006-09-13
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] 1. The circuit board is heated through the heat conduction of the air to melt the solder, which has low heat utilization efficiency and high energy consumption
[0010] 2. Heating in the air will volatilize or oxidize the toxic elements in the circuit board, emitting toxic and harmful substances, such as polychlorinated biphenyls, diphenyl dioxins, diphenyl furans, etc., causing environmental pollution and operator poisoning
[0011] 3. Due to the low thermal conductivity of the air, in order to make th

Method used

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  • Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium
  • Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium
  • Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium

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Embodiment

[0044] Submerge the circuit board to be processed with soldered components in the liquid heat-conducting medium, keep the liquid heat-conducting medium at the temperature at which the solder melts, and collect the solder, circuit board and components separately after the solder is melted. In the specific implementation, the circuit board should be kept Both the board and the pins of the components with solder attached to it can be completely immersed in the heat-conducting medium.

[0045] The circuit board to be processed is placed with the component facing upwards and suspended horizontally in the heat-conducting medium, and ultrasonic vibration is applied to the heat-conducting medium and / or mechanical vibration is applied to the circuit board.

[0046] The heat conduction medium is silicone oil with a boiling point of 250°C-300°C, a flash point of 300°C-350°C, and a liquid at room temperature. Silicone oil is resistant to high temperatures and has a high ignition point. It ...

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Abstract

This invention relates to a method and a device for de-soldering and separating elemeeents characterizing in dipping a CB to be processed with soldered elements in a liquid heat conducting medium, which is kept at the temperature of melting solder tin and the solder tin, CB and elements are collected after the tin is melted.

Description

Technical field: [0001] The invention relates to a method and a device for desoldering a printed circuit board and separating components. Background technique: [0002] For the recycling of printed circuit boards with components fixed by solder, it is first necessary to remove the solder and then separate the components, so as to recycle the solder and usable electronic components. [0003] In our country, manual disassembly of components is the main method at present, but the work efficiency is low and does not meet the requirements of industrial processing. [0004] According to reports, NEC Corporation of Japan has developed an automatic disassembly system for chips. The system includes two heating units and two removal units. The first removal unit is equipped with impact thrusters and PCB return arms, and the second removal unit is equipped with Shear propeller. The PCB board is first heated in the air at a temperature exceeding the melting point of the solder (180 de...

Claims

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Application Information

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IPC IPC(8): H05K3/00B09B1/00H99Z99/00
CPCY02W30/30
Inventor 宋守许潘君齐刘志峰刘光复胡张喜
Owner HEFEI UNIV OF TECH
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