Method for preparing film surface of nanometer-stage thickness on red copper surface

A copper and thin film technology, applied in the direction of metal material coating process, can solve the problems of complex equipment, high cost, difficult industrialization, etc., and achieve the effect of reducing surface energy, easy to grasp, and uniform and dense thin film

Inactive Publication Date: 2008-07-09
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods generally have disadvantages such as high cost or complicated equipment, and are difficult to realize industrialization.
The liquid phase deposition method is a method for preparing thin film surfaces developed in recent years. At present, this method has been widely used to prepare photocatalytic surfaces on glass, but the method of preparing nanometer-thick thin film surfaces on copper surfaces by liquid deposition has not yet been There are reports

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  • Method for preparing film surface of nanometer-stage thickness on red copper surface

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Embodiment 1

[0020] (a) carry out pretreatment to copper substrate, utilize 300 at first # The copper base is polished with emery, and after the entire surface of the copper is covered with black emery, 500 # The corundum continues to grind the above substrate until 500 # The corundum replaces the original 300 tiled on the substrate # until the emery particles are evenly spread on the copper substrate; then use 4μm emery paste for mechanical polishing until all the black emery on the substrate is removed, and then use 0.5μm emery paste to continue polishing until the surface is invisible to the naked eye until it is scratched; then use 3% by mass of dilute hydrochloric acid to soak the substrate for 30 minutes to remove the oxide on the surface; then immerse the substrate in 10% by mass of sodium hydroxide solution for 20 minutes to remove some Grease; take out the substrate, put an appropriate amount of detergent on it, and repeatedly scrub it with absorbent cotton. After scrubbing, rin...

Embodiment 2

[0022] (a) carry out pretreatment to copper substrate, utilize 200 at first # Grinding the copper base with emery, and after the entire surface of the copper is covered with black emery, use 550 # The corundum continues to grind the above substrate until 550 # The corundum replaces the original 200 tiled on the base # until the emery particles are evenly spread on the copper substrate; then use 1 μm emery paste for mechanical polishing until all the black emery on the substrate is removed, and then use 0.9 μm emery paste to continue polishing until the surface is invisible to the naked eye until it is scratched; soak the substrate with 2% by mass of dilute hydrochloric acid for 5 minutes to remove the oxide on the surface; then immerse the substrate in 5% by mass of sodium hydroxide solution for 5 minutes to remove some Grease; take out the substrate, put an appropriate amount of detergent on it, and repeatedly scrub it with absorbent cotton. After scrubbing, rinse the subst...

Embodiment 3

[0024] (a) carry out pretreatment to copper substrate, utilize 400 at first # Polish the copper base with emery, and after the entire surface of the copper is covered with black emery, use 600 # The corundum continues to grind the above substrate until 600 # The corundum replaces the original 200 tiled on the base # until the emery particles are evenly spread on the copper substrate; then use 3μm emery paste for mechanical polishing until all the black emery on the substrate is removed, and then use 1μm emery paste to continue polishing until the surface cannot be scratched by naked eyes Then soak the substrate with 1% by mass of dilute hydrochloric acid for 10 minutes to remove surface oxides; then immerse the substrate in 15% by mass of sodium hydroxide solution for 25 minutes to remove part of the grease Take out the substrate, put an appropriate amount of detergent on it, and repeatedly scrub with absorbent cotton. After scrubbing, rinse the substrate with distilled wate...

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Abstract

The invention discloses a method for preparing a film surface with nanometer thickness on the surface of copper, the method comprises V1ing, a substrate of the copper is pretreated. V2ing, chemical pure (NH4)2TIF6 and analytically pure boric acid are respectively prepared into uniform solution, and the two solution are equably mixed. V3ing, prepared sedimentary solution is heated in water bath, after the temperature of the sedimentary solution is constant, the substrate of the copper is vertically put into the solution, the film begins to be prepared until reaches to a predetermined thickness. V4ing, the substrate is removed, and residues on the surface are removed. V5ing, the substrate is naturally dried in room temperature, and then is put in a heating device to heat, after being naturally cooled, a uniform compact titanium oxide film surface is obtained. Because the method of the invention uses a unique pretreatment method, the film on the surface of the prepared copper is uniform and compact, has the nanometer thickness, is capable of effectively reducing the surface energy of a heat transfer surface, fouling in a heat interchanger not easy to adhere on the surface, thereby playing a certain effect of preventing and removing scale.

Description

technical field [0001] The invention relates to a method for preparing a nanometer film surface with low surface energy, in particular to a method for preparing a film surface with a nanometer thickness on the surface of red copper by using a liquid phase deposition method. Background technique [0002] At present, there are fouling problems in the operation of heat exchange equipment. The deposition of dirt leads to the increase of heat transfer resistance and the reduction of heat transfer efficiency, resulting in waste of energy and wear of equipment. In order to reduce the deposition of dirt, traditional mechanical descaling or chemical agents are used to remove dirt, but there are common problems of high cost and secondary pollution. Studies have shown that reducing the surface energy of heat transfer surfaces reduces fouling formation. Researchers have adopted surface treatment technology to treat the heat transfer surface to reduce the surface energy of the heat tra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/34C23C22/77C23C22/78C23C22/82
Inventor 刘明言王琳琳王燕朱博
Owner TIANJIN UNIV
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