Method for preparing film surface of nanometer-stage thickness on red copper surface

Abstract

The invention discloses a method for preparing a film surface with nanometer thickness on the surface of copper, the method comprises V1ing, a substrate of the copper is pretreated. V2ing, chemical pure (NH4)2TIF6 and analytically pure boric acid are respectively prepared into uniform solution, and the two solution are equably mixed. V3ing, prepared sedimentary solution is heated in water bath, after the temperature of the sedimentary solution is constant, the substrate of the copper is vertically put into the solution, the film begins to be prepared until reaches to a predetermined thickness. V4ing, the substrate is removed, and residues on the surface are removed. V5ing, the substrate is naturally dried in room temperature, and then is put in a heating device to heat, after being naturally cooled, a uniform compact titanium oxide film surface is obtained. Because the method of the invention uses a unique pretreatment method, the film on the surface of the prepared copper is uniform and compact, has the nanometer thickness, is capable of effectively reducing the surface energy of a heat transfer surface, fouling in a heat interchanger not easy to adhere on the surface, thereby playing a certain effect of preventing and removing scale.

Description

technical field [0001] The invention relates to a method for preparing a nanometer film surface with low surface energy, in particular to a method for preparing a film surface with a nanometer thickness on the surface of red copper by using a liquid phase deposition method. Background technique [0002] At present, there are fouling problems in the operation of heat exchange equipment. The deposition of dirt leads to the increase of heat transfer resistance and the reduction of heat transfer efficiency, resulting in waste of energy and wear of equipment. In order to reduce the deposition of dirt, traditional mechanical descaling or chemical agents are used to remove dirt, but there are common problems of high cost and secondary pollution. Studies have shown that reducing the surface energy of heat transfer surfaces reduces fouling formation. Researchers have adopted surface treatment technology to treat the heat transfer surface to reduce the surface energy of the heat tra...

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Problems solved by technology

However, these methods generally have disadvantages such as high cost or complicated equipment, and are difficult to realize industrialization.

The liquid phase deposition method is a method for preparing thin film surfaces developed in recent years. At present, this method has been widely used to prepare photocatalytic surfaces on glass, but the method of preparing nanometer-thick thin film surfaces on copper surfaces by liquid deposition has not yet been There are reports

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