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speaker module

A loudspeaker module and loudspeaker technology, which is applied in the direction of sensors, loudspeakers, and sensor parts, etc., can solve the problems of insufficient filling of polymer nanopowder and poor sound amplification effect, etc.

Inactive Publication Date: 2021-02-23
AAC TECH PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technical problems, the present invention provides a novel loudspeaker module to solve the problems of insufficient filling of polymer nanopowder and poor sound amplification effect in the prior art. The specific solution is:

Method used

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with the accompanying drawings.

[0023] Such as figure 1 with figure 2 As shown, the present invention provides a speaker module 100 , which includes a casing 1 with a receiving space and a speaker unit 3 accommodated in the casing 1 .

[0024] The housing 1 includes an upper housing 11 having a top wall 101 and a lower housing 12 having a bottom wall 102 . At least one of the upper shell 11 or the lower shell 12 has a bent and extended side wall 103 . The side wall 103 and the top wall 101 and the bottom wall 102 define a receiving space. The sidewalls 103 can be in regular shapes parallel to each other, or in irregular structures.

[0025] The accommodation space includes unit accommodation chambers 10 arranged at intervals to accommodate the speaker unit 3 , and first and second filling chambers 20 and 30 respectively disposed on both sides of the speaker unit 3 to accommodate filling material...

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Abstract

The speaker module of the present invention includes a housing and a speaker unit housed in the housing, the housing includes a bottom wall, a top wall and a side wall, and at least one first isolation component connected to the bottom wall and the top wall respectively, The first isolation assembly divides the storage space into a cell storage chamber and a first filling chamber. The first isolation assembly includes a first metal frame and a breathable isolation net attached to the first metal frame. The first metal frame includes a first upper The frame, the first lower frame, the first upper frame and / or the first lower frame are provided with protruding protrusions, the protrusions abut against the top wall or the bottom wall, and pass through points between the top wall or the bottom wall Solder connection. The loudspeaker module of the present invention divides the storage space into at least two parts by setting an isolation component, seals the filling cavity and isolates it from the speaker unit, so that the filling cavity can be completely filled with filling materials, the space can be fully utilized, and the sound amplification effect can be improved. , improve product performance.

Description

technical field [0001] The invention relates to the field of electroacoustic conversion, in particular to a loudspeaker module. Background technique [0002] With the advent of the mobile Internet era, electronic products are being updated faster and faster, and people have higher and higher requirements for the performance of electronic products. One of them is the high-quality music function. Therefore, the electroacoustic system It is necessary to continuously improve performance, and a high-quality speaker module is one of the prerequisites for realizing this high-quality music function. [0003] DBASS polymer nano-amplification technology is gradually widely used in various electronic products due to its good sound effect. The current method of preparing speaker modules using the DBASS process is usually to first pour DBASS polymer nanopowder into a specific area on the casing, and then set the mesh to block the poured polymer nanopowder and then install the speaker un...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/02H04R9/06H04R2400/11H04R1/288H04R2499/11
Inventor 陈志臣魏威
Owner AAC TECH PTE LTD