Convenient-to-disassemble anti-seepage cable connection system
A waterline and wire technology, which is applied in the electronic field, can solve the problems of line cutting, loose tape wrapping, and inability to block water, etc., to achieve thorough contact, avoid poor contact, and facilitate handling and disassembly.
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2018-11-16
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Abstract
Description
technical field
[0001] The invention relates to the field of electronic technology, in particular to an easy-to-detach water-proof cable connection system. Background technique
[0002] At present, when dealing with the connection between two or more individual wires, the following methods are usually used: first, the insulation protection layer of the wires is stripped, the wire cores are exposed and connected, and an insulating tape is used to wrap the connected cores . However, in the above method using the insulating tape, a tool for peeling off the insulating protective layer and winding the wire core is required. Also, the connection operation is complicated and troublesome.
[0003] Second, peel off the insulation protection layer of the wire, and then clamp the wire core on the conductor in the connector, usually by screws. However, such a connection method also needs to use a tool for stripping the insulating layer, and its operation is also troublesome and compl...
Examples
Embodiment Construction
[0032] In order to make the above objects, features and advantages of the present invention more obvious and comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0033] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.
[0034] Second, "one embodiment" or "an embodiment" referred to herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. "In one embodiment" appearing in different places in this specification does not all refer to ...