A kind of LED packaging substrate and LED packaging structure
A technology of LED packaging and LED lamps, which is applied to lighting devices, components of lighting devices, lighting and heating equipment, etc. It can solve the problems of not being able to be easily packaged, not being able to fix LED lights, and being inconvenient to operate.
Active Publication Date: 2020-11-13
山东永而佳电子科技有限公司
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Problems solved by technology
[0003] The purpose of the present invention is to provide an LED packaging base and LED packaging structure to solve the problem that the existing LED packaging base and LED packaging structure proposed in the above background technology cannot better fix the LED lamp when in use, and at the same time, the packaging It cannot be easily packaged and the operation is inconvenient
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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0025] see Figure 1-4 , the present invention provides a technical solution: an LED packaging base and LED packaging structure, including a fixed base 1, a horizontal buckle 6, a vertical buckle 8, a compression spring 10, a fixed block 12 and a screw hole 13, and the fixed base 1 is fixed on the bottom of the device base 2, and there is a package slot 3 in the middle of the device base 2. The inside of the package slot 3 is a thread structure, and the size o...
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The invention discloses an LED package substrate and an LED package structure. The LED package substrate comprises a fixed base, transverse buckles, vertical buckles, compression springs, fixed blocksand screw holes. The fixed base is arranged at the bottom of a device substrate, and a package groove is formed at the middle position in the device substrate. The compression springs are arranged incompression snap-fasteners, and the positions of the two ends of each compression snap-fastener are fixedly connected pressing blocks. The fixed blocks are fixed to the upper surface of the device substrate, and the screw holes are formed on the upper surface of the fixed substrate. According to the LED package substrate and the LED package structure, through grooves and buckle grooves are arranged on the outer side of the package groove, when the vertical buckles are pressed downwards, the transverse buckles can be extruded rightwards, and therefore the transverse buckles are clamped in through holes at the bottom of an LED lamp; meanwhile, when the compression snap-fasteners are compressed, through the action of the compression springs, the compression snap-fasteners can contract, thenthe compression snap-fasteners are fixed below the fixed blocks, and therefore the transverse buckles are extruded; and the LED bottom and the device substrate can be packaged well.
Description
technical field [0001] The invention relates to the technical field of LED lighting devices, in particular to an LED packaging substrate and an LED packaging structure. Background technique [0002] In recent years, with the rise of the concept of energy saving around the world, the general lighting technology using white LEDs has developed rapidly, especially in the field of street lighting applications for outdoor lighting, and the general application level in the market has far exceeded that of ordinary energy-saving lighting. The luminous efficiency of the lamp, and as white LED technology is more and more widely used in the general lighting market, the requirements for the luminous efficiency and luminous quality of white LED devices are also getting higher and higher. LED packaging base and LED packaging structure, but the LED packaging base and LED packaging structure currently on the market cannot better fix the LED lamp when used, and at the same time cannot be easi...
Claims
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IPC IPC(8): F21K9/90F21V19/00F21V17/16F21V23/00F21Y115/10
CPCF21K9/90F21V17/164F21V19/002F21V23/005F21Y2115/10
Inventor 杨洪文周宏唐伍生方志彦
Owner 山东永而佳电子科技有限公司