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CMC components with microchannels and methods for forming microchannels in cmc components

A technology of microchannels and microchannel plates, applied in parts of pumping devices for elastic fluids, supporting elements of blades, chemical instruments and methods, etc., can solve problems such as less cooling

Active Publication Date: 2022-04-26
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although composite parts typically require significantly less cooling or no cooling compared to metallic parts, it may still be desirable to cool composite parts, for example, to extend the life of the part, further improve part performance, etc.

Method used

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  • CMC components with microchannels and methods for forming microchannels in cmc components
  • CMC components with microchannels and methods for forming microchannels in cmc components
  • CMC components with microchannels and methods for forming microchannels in cmc components

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Embodiment Construction

[0064] Reference will now be made in detail to present embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. Numeral and letter designations are used in the detailed description to refer to features in the drawings. The same or similar symbols have been used in the drawings and description to refer to the same or similar parts of the present invention. As used in this specification, the terms "first", "second" and "third" are used interchangeably to distinguish one element from another and are not intended to indicate the position or importance of each element. The words "upstream" and "downstream" refer to relative directions with respect to fluid flow in a fluid path. For example, "upstream" refers to the direction in which fluid flows out, while "downstream" refers to the direction in which fluid flows.

[0065] Referring now to the drawings, wherein like numerals indicate like elements throughout, figure 1 is a schemat...

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PUM

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Abstract

CMC components having microchannels and methods for forming microchannels in CMC components are provided. For example, a method for forming microchannels in a CMC component includes: laying down a plurality of body plies forming a body of the CMC component; laying down microchannel plies on the plurality of body plies , there is at least one void for forming at least one microchannel in the microchannel ply; laying a cover ply on the microchannel ply, the cover ply defines the outer layer of the CMC component; and processing The main body ply, microchannel ply and cover ply are laid to form the CMC component. In another embodiment, the method includes applying an additive matrix to the body ply to define at least one microchannel. In yet other embodiments, the method includes machining at least one microchannel in the plurality of body plies.

Description

technical field [0001] The inventive subject matter generally relates to composite components. More specifically, the present subject matter relates to ceramic matrix composite components having cooling features and methods for forming such cooling features. Background technique [0002] More generally, non-traditional high temperature composite materials such as ceramic matrix composite (CMC) materials and polymer matrix composite (PMC) materials are being used in applications such as gas turbine engines. Components constructed from such materials have higher temperature capabilities than typical components, such as metal components, which may allow for improved component performance and / or increased engine temperatures. However, although composite components typically require significantly less cooling or no cooling than metal components, it may still be desirable to cool composite components, eg, to extend the life of the component, further improve component performance,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F01D5/18F01D5/28F01D9/04F01D25/00F01D25/12
CPCF01D5/186F01D5/187F01D5/282F01D5/284F01D5/288F01D9/041F01D25/005F01D25/12F05D2300/608F01D5/147F05D2260/204F05D2300/6033F04D29/388F04D29/584B23P15/02F04D29/324F05D2230/90F05D2250/185B32B18/00C04B2237/38C04B35/80C04B2235/666C04B2235/6026C04B2235/665C04B35/653Y02T50/60C04B35/571C04B35/14C04B35/117C04B2235/5244C04B2235/5232C04B38/0003C04B2111/00982B23P2700/06F01D9/02F04D29/38F04D29/542F04D29/582F05D2220/32F05D2230/10F05D2230/50F05D2260/202
Inventor D.A.弗雷K.D.加利耶H.C.罗伯茨
Owner GENERAL ELECTRIC CO
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