Soc chip local magnetic shield packaging method and soc chip local magnetic shield package
A packaging method and magnetic shielding technology, which is applied in the field of SoC chip local magnetic shield package and SoC chip local magnetic shield package, can solve the problems of unfavorable cost control and weakened MRAM shielding effect, etc.
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[0027] Figure 3 to Figure 6 is a schematic diagram of a SoC chip local magnetic shield packaging method according to a preferred embodiment of the present invention.
[0028] Such as Figure 3 to Figure 6 As shown, the SoC chip local magnetic shield packaging method according to a preferred embodiment of the present invention includes:
[0029] The first step: forming a SoC bare chip 100, wherein an MRAM functional module 10 and a non-MRAM functional module 20 are formed in the SoC bare chip 100;
[0030] Second step: form the first groove 11 on the back side of the SoC bare chip 100, and the first groove region 11 covers the MRAM functional module 10 in the direction from the front to the back side, and the MRAM is formed on the front side of the SoC bare chip 100. A second annular groove 12 is formed around the functional module 10;
[0031] From the front to the back, the first groove 11 does not overlap with the non-MRAM functional module 20 , and the surrounding area ...
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