Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Variable-temperature middle-measurement dewar and dewar component for chip testing

A technology for chip testing and window components, applied in the field of detectors, can solve the problems such as the cooling time, the cooling rate is not adjustable, the temperature cannot be lowered below 77K, and the use requirements cannot be met, and the assembly test is simple and convenient.

Inactive Publication Date: 2018-12-25
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
View PDF5 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing liquid nitrogen mid-measuring Dewar is limited by the refrigerant. The liquid nitrogen mid-measuring Dewar can only be filled with liquid nitrogen, and the chip is lowered to a temperature of 77K by using liquid nitrogen. The cooling time and cooling rate are fixed and cannot be adjusted. And the temperature cannot drop below 77K, so for special temperature (low temperature lower than 77K) the Dewar in the chip can not meet the use requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Variable-temperature middle-measurement dewar and dewar component for chip testing
  • Variable-temperature middle-measurement dewar and dewar component for chip testing
  • Variable-temperature middle-measurement dewar and dewar component for chip testing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0028] In the first embodiment of the present invention, there is provided a kind of variable temperature middle-measure Dewar for chip testing, see figure 1 , figure 2 and image 3 As shown, it includes a casing 4, a first cold finger 9 and a cold head 10 arranged in the casing 4, a window assembly and a connector 8 arranged outside the casing 4, and an exhaust nozzle 5 arranged on the casing 4. The gas nozzle 5 vacuum exhausts...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a variable-temperature middle-measurement dewar and dewar component for chip testing. The variable-temperature middle-measurement dewar comprises a casing, a first cold finger,a cold head, a window component, a connector and a gas discharge nozzle, the first cold finger and the cold head are disposed in the casing, the window component and the connector are disposed outside the casing, the gas discharge nozzle is disposed on the casing, the bottom of the casing is provided with a flange for connecting to a refrigerator, the first cold finger in the casing comprises a plurality of layers of hollow support tubes, and the inner cavities of the support tubes are used to sleeve a second cold finger of the refrigerator. The variable-temperature middle-measurement dewar can realize the testing of a low temperature chip.

Description

technical field [0001] The invention relates to the field of detectors, in particular to a variable temperature mid-measurement Dewar and a Dewar assembly for chip testing. Background technique [0002] Infrared detector technology has the characteristics of passive detection, high detection accuracy and strong environmental adaptability, and is widely used in night vision, astronomical observation and other fields. [0003] After the infrared detector chip is prepared, it needs to be tested to check its electrical performance before the formal component packaging. This process is called chip mid-test. Chip mid-test is an essential step in the process of realizing infrared detector semiconductor products. Provide a low-temperature environment for the infrared detector chip through the mid-test Dewar to test whether the infrared detector chip can achieve the intended function, and provide a measure for the quality and reliability of the final product. The current test metho...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01J5/02
CPCG01J5/0205
Inventor 付志凯甘玉梅范博文韦书领谭振
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com