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Fan-less chiller-less liquid-air cooling for electronic racks of it components in data centers

A technology for data centers and electronic devices, which is applied in the fields of digital data processing components, electrical digital data processing, electrical equipment structural components, etc., and can solve problems such as the reduction of server reliability.

Active Publication Date: 2019-01-18
BAIDU COM TIMES TECH (BEIJING) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A server used in a data center will be less reliable if the environment in which the server operates is allowed to increase in temperature over time

Method used

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  • Fan-less chiller-less liquid-air cooling for electronic racks of it components in data centers
  • Fan-less chiller-less liquid-air cooling for electronic racks of it components in data centers
  • Fan-less chiller-less liquid-air cooling for electronic racks of it components in data centers

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Embodiment Construction

[0015] Various embodiments and aspects of the invention will be described with reference to details discussed below and illustrated in the accompanying drawings. The following description and drawings are illustrative of the present invention and should not be construed as limiting the present invention. Numerous specific details are described in order to provide a thorough understanding of various embodiments of the invention. However, in certain instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the invention.

[0016] Reference in this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The appearances of the phrase "in one embodiment" in various places in this specification are not necessarily all referring to the same embodimen...

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PUM

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Abstract

A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to anexternal environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heatgenerated by the servers to the external environment eliminating chiller and IT fans.

Description

technical field [0001] Embodiments of the invention generally relate to data centers. More specifically, embodiments of the present invention relate to fanless chiller-less liquid-air cooling for electronics racks in data centers. Background technique [0002] Heat dissipation is a prominent factor in computer system and data center design. The number of high-performance electronic devices, such as high-performance CPUs and GPUs packaged inside servers, has steadily increased, thereby increasing the amount of heat generated and dissipated during normal operation of the server. The reliability of a server used in a data center decreases if the environment in which the server operates is allowed to increase in temperature over time. Maintaining a proper thermal environment is critical to the proper operation of these servers in the data center. Especially in the case of cooling these high-performance servers, more efficient cooling solutions are required. Most of the elect...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/20H05K7/20736H05K7/2079H05K7/20745H05K7/20754H05K7/20772H05K7/20836
Inventor 高天翼崔岩孙晓钢阿里·海达里
Owner BAIDU COM TIMES TECH (BEIJING) CO LTD