A viscosifying unit hmds purging structure

Abstract

The present invention relates to the technical field of semiconductor glue leveling and development, in particular to an HMDS purging structure of a thickening unit, wherein the upper plate cover is installed on the support base, the upper end cover is installed in the middle of the upper plate cover, and the bottom plate of the support base There is a boss on the top, the hot plate body is fixed on the boss, the wafer is placed on the hot plate body, the upper end cover, the upper plate cover, the side wall of the support seat, the boss and the heat plate body Synthetic sealed space, a rectifying plate is arranged in the sealed space, and a purge area is formed between the hot plate body and the rectifying plate, a return air area is formed between the rectifying plate and the upper plate cover, and in the purging area The gas flows into the air return area from the edge of the rectifying plate, and the upper end cover is provided with an air intake channel and an air outlet groove, the air intake channel communicates with the purge area, and the purge port of the air intake channel is a flared structure. The air outlet slot communicates with the air return area, and an air outlet is arranged on the outer wall of the air outlet slot. The invention improves the purging uniformity of the thickening unit HMDS and ensures the thickening effect.

Description

Technical field[0001]The present invention relates to the field of semiconductor homogenizing development techniques, and in particular to a tonifying unit HMDS purge structure.Background technique[0002]In the prior art, according to the semiconductor manufacturing process requirements, the wafer first needs to be sent to the adhesive unit before being sent into the homogeneous cavity, and the wafer is first required to be sent to the adhesive unit. The surface hydrophilicity is changed to hydrophobicity, and the effect of this tackifying treatment is huge to the post-homogeneous process. In the prior art, since there are strict requirements for the spatial size of the machine, the unit components are usually required to save space, improve the competitiveness of the machine, reduce customer costs, but the overall size of the unit leads to increased adhesive units. The HMDS air port can only be located on the side of the disc, and the HMDS airflow is guided by the air in the horizon...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, according to the requirements of the semiconductor manufacturing process, the wafer needs to be sent to the viscosity-increasing unit for processing before being sent into the uniform glue chamber. The surface hydrophilicity is changed to hydrophobicity, and the effect of this viscosity-increasing treatment has a great influence on the late glue leveling process

In the prior art, due to strict requirements on the space size of the machine, it is usually required that each unit part is small and precise, so as to save space, improve the market competitiveness of the machine, and reduce customer costs, but the overall size of the unit is small, resulting in the viscosity of the thickening unit. The HMDS air inlet can only be located on the side of the pan, the air is drawn in horizontally and then the HMDS air is guided out through the upper end cover of the pan

In the actual process, due to the large amount of air intake, the fast air intake speed, and the small size of the space, there is usually not enough space for the velocity vector in the horizontal direction of the air intake on the side of the disk to change direction, so the purge When the wafer is used, assuming that the exhaust air and air outlet resistance of the surrounding areas are consistent, the air volume in the extending direction of the intake pipe is relatively large, and most of the air volume is blown away directly. Uneven purging, limited viscosifying effect

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