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Semiconductor laser and preparation method thereof

一种激光器、半导体的技术,应用在半导体激光器、激光器、激光器零部件等方向,能够解决输出功率下降、减小增益区域面积等问题

Active Publication Date: 2019-03-08
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology

Most of the existing methods are to reduce the width of the waveguide of the semiconductor laser, thereby reducing the number of lateral modes and improving the beam quality. However, reducing the width of the waveguide also reduces the area of ​​the gain region, so the output power is also greatly increased. decline

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  • Semiconductor laser and preparation method thereof
  • Semiconductor laser and preparation method thereof
  • Semiconductor laser and preparation method thereof

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Embodiment Construction

[0040] The core of the present invention is to provide a semiconductor laser. In the prior art, in order to reduce the number of lateral modes in the semiconductor laser, the width of the waveguide of the semiconductor laser is usually reduced, but since reducing the waveguide width also reduces the area of ​​the gain region, the output power is also greatly reduced.

[0041]And a kind of semiconductor laser provided by the present invention, in the inner ridge region of the surface of the transmission layer facing away from the substrate, a clipping loss region is provided, and a blind hole is arranged in the clipping loss region, and the bottom surface of the blind hole is in contact with the second cladding layer. The distance towards the surface of the substrate side is smaller than the evanescent wave length in the transmission layer. Since the distance between the blind hole and the surface of the second cladding layer facing the substrate is smaller than the length of t...

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Abstract

The invention discloses a semiconductor laser. A shearing loss region is disposed in an inner ridge region of the surface of one side of a transport layer, which is backed on to a substrate; blind holes are formed in the shearing loss region; a distance between the bottom surface of each blind hole and the surface of one side of a second cladding, which faces the substrate, is smaller than a length of an evanescent wave in the transport layer. The blind holes can influence the light field characteristics of light transmission in the semiconductor laser by influencing the evanescent wave. The shearing loss region is a region which is at a distance smaller than 25% of a length of a wide edge of the inner ridge region from any one long edge of the inner ridge region and at a distance smallerthan 20% of a length of the long edge of the inner ridge region from any one wide edge of the inner ridge region, the blind holes can effectively increase loss of a high-order mode in the semiconductor laser and improve beam quality of laser; and meanwhile, a width of a waveguide of the semiconductor laser does not need to be reduced, so that the semiconductor laser has high brightness. The invention further provides a preparation method of a semiconductor laser, and the prepared semiconductor laser also has the beneficial effects above.

Description

technical field [0001] The invention relates to the technical field of semiconductor optoelectronic devices, in particular to a semiconductor laser and a method for preparing the semiconductor laser. Background technique [0002] The brightness of a semiconductor laser is proportional to the ratio of power to beam quality, reflecting the laser power per unit solid angle. In practical applications, semiconductor lasers are often expected to have high output power and excellent beam quality, that is, high brightness. Most of the existing methods are to reduce the width of the waveguide of the semiconductor laser, thereby reducing the number of lateral modes and improving the beam quality. However, reducing the width of the waveguide also reduces the area of ​​the gain region, so the output power is also greatly increased. decline. [0003] Therefore, how to improve the beam quality of the semiconductor laser without significantly reducing the output power of the semiconducto...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/22H01S5/32H01S5/065
CPCH01S5/0653H01S5/22H01S5/32H01S5/1017H01S5/2036H01S5/3412H01S2301/166H01S2301/18H01S5/026H01S5/0425H01S5/2202H01S5/34
Inventor 佟存柱宿家鑫汪丽杰舒世立田思聪张新王立军
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI