Susceptor for wafer

A chip and base technology, applied in discharge tubes, electrical components, circuits, etc., can solve problems such as inability to ensure insulation
CN109478531AActive Publication Date: 2019-03-15NGK INSULATORS LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NGK INSULATORS LTD
Publication Date
2019-03-15

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Abstract

In an insulating pipe 30, an abutment surface 34a of the insulating pipe 30 abuts on a stopper surface 27a of a cooling plate 20. Thus, the insulating pipe 30 is blocked from further intruding into ascrew hole 26, the end surface 33a of an annular projection 33 of the insulating pipe 30 is positioned at a prescribed position that is not in contact with a plate 12, and an O ring 40 is deformed bya prescribed amount by being compressed between a stepped surface 32a of the insulating pipe 30 and the lower surface of the plate 12.
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Description

technical field

[0001] The present invention relates to a wafer susceptor used in semiconductor manufacturing equipment. Background technique

[0002] As wafer susceptors used in semiconductor manufacturing equipment, electrostatic chucks, vacuum chucks, and the like are known. For example, the electrostatic chuck described in Patent Document 1 is formed by bonding a flat plate made of ceramics embedded with electrodes that generate electrostatic attraction force to a cooling plate made of metal via a resin layer, and has a through hole penetrating the flat plate and the cooling plate. . The through holes are used for insertion of lift pins for lifting a wafer placed on the plate, or for supplying gas between the back surface of the wafer and the plate. An insulating tube is inserted into a portion of the through hole that penetrates the cooling plate (cooling plate penetration portion). The insulating tube is bonded to the cooling plate with an adhesive interposed betwee...

Claims

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