Circuit board plating line intelligent board feeding and discharging method capable of achieving accurate positioning

A precise positioning and circuit board technology, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems that the electroplating clip cannot clamp the circuit board, affect the plating quality of the circuit board, and the board drop rate, etc., to reduce the time, The effect of reducing the impact and reducing the drop rate

Inactive Publication Date: 2019-04-02
佛山市阳和智能科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, the suction cup absorbs the middle position of the circuit board and contacts with the circuit board, which easily deforms the circuit board and affects the plating quality of the circuit board
[0005] Moreover, in the step of robot loading and unloading, the position set by the robot is fixed, and the electroplating flybar will be deformed during the process of hoisting and electroplating. Among them, the electroplating flybar is in the process of electroplating in the plating tank Due to the shaking of the electroplating solution and the deformation of the force, the position

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  • Circuit board plating line intelligent board feeding and discharging method capable of achieving accurate positioning
  • Circuit board plating line intelligent board feeding and discharging method capable of achieving accurate positioning
  • Circuit board plating line intelligent board feeding and discharging method capable of achieving accurate positioning

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Embodiment Construction

[0052] Below in conjunction with accompanying drawing and specific embodiment, the present invention is described further, so that understand the technical thought that the present invention claims protection more clearly. It is only stated here that the words for directions such as up, down, left, right, front, back, inside, and outside that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention, and are not specific to the present invention. limited.

[0053] Such as Figure 1-8 Shown, a kind of circuit board 9 electroplating lines intelligent upper and lower plate methods that can be precisely positioned in the embodiment of the invention may further comprise the steps:

[0054] A, Grab the circuit board 9 on the material frame 2 through the clamping device 5 at the end of the upper and lower board robot 3;

[0055] B. The electroplating clip 11 on the electroplating flying bus 1 is photographed by t...

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Abstract

The invention relates to the field of circuit board electroplating technologies, in particular to a circuit board plating line intelligent board feeding and discharging method capable of accurate positioning. Circuit board feeding and discharging operation is conducted by a feeding and board discharging robot which replaces manual work on a plating hoist, transformation of the plating hoist is detected through a visual detecting device, angle offset is analyzed and calculated, and angle compensation is made by controlling the feeding and discharging board robot in the process of feeding and discharging board. The invention provides the circuit board plating line intelligent board feeding and discharging method capable of accurate positioning, 3D data can be acquired precisely by the visualdetecting device, meanwhile position compensation is conducted on plating of the transformative plating hoist, it is guaranteed that a circuit board can be stably clamped by a plating clamp, and therate of plate falling is greatly decreased in the plating step.

Description

technical field [0001] The invention relates to the field of circuit board electroplating technology, in particular to a method for intelligently loading and unloading circuit board electroplating lines that can be precisely positioned. Background technique [0002] The electroplating flybar is an important part of the circuit board electroplating line. Its function is to fix the circuit board and transfer the circuit board to different electroplating pools for electroplating. The upper and lower plates are important processes in the electroplating production steps of the circuit board. [0003] Most of the traditional circuit board electroplating lines adopt the method of manual loading and unloading, that is, manually move the unplated circuit board to the electroplating clip on the electroplating flybar for clamping or manually put the electroplating clip on the electroplating flybar to complete the electroplating line Take it off, the work efficiency is low. The four si...

Claims

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Application Information

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IPC IPC(8): C25D7/00C25D17/06C25D21/12C25D17/00
CPCC25D7/00C25D17/00C25D17/06C25D21/12
Inventor 刘振锋
Owner 佛山市阳和智能科技有限公司
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