Circuit board plating line intelligent board feeding and discharging method capable of achieving accurate positioning

Abstract

The invention relates to the field of circuit board electroplating technologies, in particular to a circuit board plating line intelligent board feeding and discharging method capable of accurate positioning. Circuit board feeding and discharging operation is conducted by a feeding and board discharging robot which replaces manual work on a plating hoist, transformation of the plating hoist is detected through a visual detecting device, angle offset is analyzed and calculated, and angle compensation is made by controlling the feeding and discharging board robot in the process of feeding and discharging board. The invention provides the circuit board plating line intelligent board feeding and discharging method capable of accurate positioning, 3D data can be acquired precisely by the visualdetecting device, meanwhile position compensation is conducted on plating of the transformative plating hoist, it is guaranteed that a circuit board can be stably clamped by a plating clamp, and therate of plate falling is greatly decreased in the plating step.

Description

technical field [0001] The invention relates to the field of circuit board electroplating technology, in particular to a method for intelligently loading and unloading circuit board electroplating lines that can be precisely positioned. Background technique [0002] The electroplating flybar is an important part of the circuit board electroplating line. Its function is to fix the circuit board and transfer the circuit board to different electroplating pools for electroplating. The upper and lower plates are important processes in the electroplating production steps of the circuit board. [0003] Most of the traditional circuit board electroplating lines adopt the method of manual loading and unloading, that is, manually move the unplated circuit board to the electroplating clip on the electroplating flybar for clamping or manually put the electroplating clip on the electroplating flybar to complete the electroplating line Take it off, the work efficiency is low. The four si...

AI Technical Summary

Problems solved by technology

However, the suction cup absorbs the middle position of the circuit board and contacts with the circuit board, which easily deforms the circuit board and affects the plating quality of the circuit board

[0005] Moreover, in the step of robot loading and unloading, the position set by the robot is fixed, and the electroplating flybar will be deformed during the process of hoisting and electroplating. Among them, the electroplating flybar is in the process of electroplating in the plating tank Due to the shaking of the electroplating solution and the deformation of the force, the position of the electroplating clips on the electroplating flybar will shift. These shifts are random and non-directional, and even the two electroplating clips holding the same circuit board are dislocated up and down. In the case that the line connecting the clamping points of the two electroplating clips forms an angle with the horizontal plane, since the circuit board is placed horizontally on the electroplating flybar for clamping, at this time, one of the electroplating clips cannot clamp the circuit In the case of the edge of the board, the drop rate of the circuit board is still high

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