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Miniature light-emitting component structure

A light-emitting element and miniature technology, which is applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of brittle cracks, transportation and transfer yield drop of micro light-emitting diodes, etc., and achieve good cushioning effect

Active Publication Date: 2019-04-23
PLAYNITRIDE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the brittleness of the material of the fixed structure itself, the fixed structure is easily brittle due to the external force received during the transportation and transfer of the micro-LEDs, resulting in a decrease in the yield of the transportation and transfer of the micro-LEDs

Method used

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  • Miniature light-emitting component structure
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  • Miniature light-emitting component structure

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Embodiment Construction

[0057] Figure 1A It is a schematic cross-sectional view showing the structure of a micro-light-emitting element according to an embodiment of the present invention. Figure 2A shown as Figure 1A A schematic top view of the micro-light-emitting device structure. It should be noted here that, Figure 1A The micro light emitting element structure 100a is along the Figure 2A The A-A' section line is shown, and for the sake of illustration, Figure 2A Some components are omitted. Please refer to Figure 1AThe micro light emitting element structure 100a of this embodiment includes a substrate 120, at least one micro light emitting element 140, a fixing structure 160a, and at least one buffer structure 180a. The micro light emitting element 140 is disposed on the substrate 120 , and there is a vertical distance H1 between the micro light emitting element 140 and the substrate 120 . The fixing structure 160 a is disposed on the substrate 120 and directly contacts the micro-light...

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Abstract

The present invention provides a miniature light-emitting component structure. The miniature light-emitting component structure comprises a substrate, at least one miniature light-emitting component,a fixed structure and at least one buffer structure. The at least one miniature light-emitting component are arranged on the substrate, and a vertical distance is formed between the at least one miniature light-emitting component and the substrate. The fixed structure is arranged on the substrate and is in direct contact with the at least one miniature light-emitting component. The buffer structure is in direct contact with the fixed structure, and the Young modulus of the buffer structure is smaller than the Young modulus of the fixed structure.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a micro light-emitting element structure. Background technique [0002] At present, the transfer of micro-LEDs is mainly to provide electrostatic force or magnetic force and other over-distance forces to transfer the micro-LEDs on the carrier substrate to the receiving substrate. Generally speaking, the light emitting diode will provide a fixed structure to hold it so that the micro light emitting diodes are easier to pick up from the carrier substrate and transported and transferred to the receiving substrate to be placed. Other factors affect quality. However, due to the brittleness of the material of the fixing structure itself, the fixing structure is vulnerable to being brittle due to the external force received during the transportation and transfer process of holding the micro LEDs, resulting in a decrease in the yield of the transportation and transfer of the micro LEDs. How...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L33/48
CPCH01L33/48H01L21/6835H01L2221/68363H01L2933/0033
Inventor 罗玉云吴志凌苏义闵
Owner PLAYNITRIDE