Mold profile design method for large component accurate hot forming with assistance of compute

Abstract

The invention provides a mold profile design method for large component accurate hot forming with assistance of a computer. The mold profile design method comprises the following steps that by takinga component target profile as an initial mold profile, a three-dimensional model is established according to the initial profile, then cooling simulation is performed on the mold with the initial moldprofile from a hot forming temperature of a component to a room temperature to obtain a cooled mold profile, then the cooled mold profile is used as an initial value of subsequent forming springbackcompensation iteration calculation, an initial value which is closer to the optimal solution is determined before the iterative process of the component forming springback compensation based on a mathematical optimization basic idea, then the initial value is iterated, and the purpose of reducing the iterative times is achieved. Compared with a mode by directly taking a component target profile asan iteration calculation initial value, the method can reduce the iterative times by about 50 percent, greatly improves the solving efficiency and saves the precious time of a mold designer; and theadvantage is more obvious especially for a large component.

Description

technical field [0001] The invention relates to the technical field of thermoforming manufacturing of metal sheets and composite materials, in particular to a method for designing a mold surface for precise thermoforming of computer-aided large-scale components. Background technique [0002] Referring to Figures 1 and 2, the thermoforming process of metal components and composite components requires corresponding forming mold surfaces to give them a shape, and the dimensional accuracy of the forming mold surface is an important guarantee for the shape and dimensional accuracy of the components. Most of the existing mold surface designs are completed by computer-aided design. Most of the current design methods directly use the target surface of the component at room temperature as the surface of the forming mold, while ignoring the shape of the forming mold at the thermoforming temperature of the component. The effect of thermal expansion deformation on the dimensional accura...

AI Technical Summary

Problems solved by technology

[0007] However, the disadvantages of the method disclosed in patent 201810739174.8 are: one is that the number of repeated iterations of step S100 and step S200 is large; workload

Due to the large workload of iterative calculations, it is time-consuming, and for large components such as aircraft skins and aircraft wings with a length

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