Pin, pin combination structure, package, and method of manufacturing same
A combined structure and package technology, applied in the assembly/disassembly of contacts, semiconductor/solid-state device manufacturing, electrical solid-state devices, etc., can solve problems such as contamination, overflow, and loose connections.
Active Publication Date: 2019-05-07
HUAWEI TECH CO LTD
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Problems solved by technology
[0004] Therefore, when filling the molding compound, the pins are connected to the housing shell or the mold by clamping, and the connection is not tightly connected, which may easily cause the poured molding compound, such as silicone gel, epoxy resin, etc. to overflow , It is easy to cause problems such as overflow glue and mold or pin contamination
Method used
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[0045] The present application provides a pin, a pin combination structure, a package body and a manufacturing method thereof. A cover plate or a skirt structure is sleeved on the pins to prevent the plastic compound from overflowing from the cavity containing the plastic compound in the mold for encapsulating the package when the plastic compound is filled.
[0046] Common packaging methods include injection molding (molding) packaging and plastic housing (housing) packaging. Injection molding packaging generally involves attaching components to a leadframe or / and a substrate, and then pouring glue so that the molding compound covers the substrate and the frame, and the pins are a part of the leadframe. During application, the pins are welded to a printed circuit board (Printed Circuit Board, PCB) to realize connection with the PCB circuit board. The position of this kind of pins is generally around the plastic package. If you want to have pins on the front or back of the pl...
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The present application provides a pin, a pin combination structure, a package, and a method of manufacturing the same. The pin is covered with a cover plate or a skirt structure to prevent the molding compound from overflowing from a cavity configured to hold the molding compound in a die configured to package the package when the plastic material is filled. The pin is applied to the package, thepackage comprises the pin, the base plate and the plastic material, the pin comprises a body and a baffle structure; the bottom portion of the body is welded on the base plate, the baffle structure sleeves the middle portion of the body, the plastic material covers the base plate and covers the portion of the body from the bottom portion to the middle portion; and the baffle structure is configured to block the plastic material to overflow from the cavity when the cavity is filled with the plastic material, the cavity is configured to hold the plastic material in the die configured to packagethe package, the cavity holds the portion of the body from the bottom portion to the middle portion and the base plate, the base plate is located at the bottom portion of the cavity, the middle portion of the body is located at the top portion of the cavity, and the side wall of the top portion of the cavity is butted against the baffle structure of the body.
Description
technical field [0001] The present application relates to the field of electronic packaging, in particular to a pin, a pin combination structure, a package body and a manufacturing method thereof. Background technique [0002] It is widely used for highly integrated modules such as chips and power modules. According to different module types, packaging materials, and connection methods, the packaging methods adopted for the modules can also be different. For example, the plastic casing packaging (housing) packaging can be that the bottom structure of the pin (pin) is welded on the substrate, or inserted into the thermoplastic part of the casing, and then filled into the plastic casing, and then filled with glue. The top structure of the pin may be crimped to the connected printed circuit board (printed circuit board, PCB) board, or may be soldered to the connected PCB board. [0003] Usually, after the bottom structure of the pin is soldered to the substrate, the housing i...
Claims
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IPC IPC(8): H01L23/498H01L21/48
CPCH01L23/49811H01L21/565H01R12/58H01R12/707H01R43/0256H01R43/24
Inventor 吴虹吕镇
Owner HUAWEI TECH CO LTD