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Megasonic cleaning method, device and megasonic cleaning equipment

A cleaning equipment and megasonic wave technology, which is applied in the field of megasonic cleaning, can solve the problems of inability to clean wafers and poor cleaning effect of wafers, etc., and achieve the effect of improving the cleaning effect

Active Publication Date: 2020-10-16
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the mechanical swing arm in the single-wafer megasonic cleaning equipment moves at a constant speed with the megasonic nozzle. It can only clean the area from the center of the wafer to the edge of the wafer, and cannot perform special cleaning on specific areas of the wafer. Resulting in poor wafer cleaning results

Method used

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  • Megasonic cleaning method, device and megasonic cleaning equipment
  • Megasonic cleaning method, device and megasonic cleaning equipment
  • Megasonic cleaning method, device and megasonic cleaning equipment

Examples

Experimental program
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Embodiment 1

[0053] This embodiment provides a megasonic cleaning method, which is applied to the controller of the megasonic cleaning equipment, such as figure 1 Shown is a flow diagram of a megasonic cleaning method comprising:

[0054] Step S102, acquiring setting parameters of the megasonic nozzle.

[0055] The embodiment of the present invention provides a human-computer interaction interface, so that the process engineer can perform parameter setting on the human-computer interaction interface according to the actual situation of the wafer, for example, setting the operating frequency, the starting point of operation, the end point of operation, the number of partitions of the wafer, Setting parameters such as the time ratio and operating unit of each partition, such as figure 2 Shown is the parameter setting diagram of the running track of the megasonic nozzle. After setting the parameters, the controller in the megasonic cleaning equipment obtains the setting parameters and contr...

Embodiment 2

[0069] Corresponding to the above method embodiments, this embodiment provides a megasonic cleaning device, which is applied to the controller of the megasonic cleaning equipment, such as Figure 4 As shown, the device includes:

[0070] The obtaining module 41 is used to obtain the setting parameters of the megasonic nozzle; the setting parameters include at least one of the following: operating frequency, operating start point, operating end point, number of wafer partitions, and time ratio of each partition;

[0071] The first determination module 42 is used to determine the operating area of ​​the megasonic shower head on the wafer according to the set parameters;

[0072] The second determination module 43 is used to determine the partition of the wafer and the running time of the megasonic shower head in each partition according to the set parameters;

[0073] The fitting module 44 is used to fit the running trajectory of the megasonic sprinkler in each zone according t...

Embodiment 3

[0082] The embodiment of the present invention provides a megasonic cleaning equipment, such as Figure 5 As shown, the megasonic cleaning equipment includes: a memory 51, a controller 52, and a computer program that can run on the controller 52 is stored in the memory 51. When the controller executes the computer program, it realizes the above-mentioned photo archiving method provided by the power transmission line equipment. step.

[0083] like Figure 5 As shown, the device also includes: a bus 53 and a communication interface 54, the controller 52, the communication interface 54 and the memory 51 are connected through the bus 53; the controller 52 is used to execute executable modules stored in the memory 51, such as computer programs.

[0084] It can be understood that, the device also includes: a megasonic shower head, which is used to clean the wafer under the action of the controller 52 .

[0085] Wherein, the memory 51 may include a high-speed random access memory (...

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Abstract

The invention provides a megasonic cleaning method and device, and megasonic cleaning equipment, and belongs to the technical field of the megasonic cleaning. Through the megasonic cleaning method anddevice, and megasonic cleaning equipment provided by the embodiment of the invention, a controller of the megasonic cleaning equipment acquires a setup parameter of a megasonic sprayer when the megasonic cleaning equipment cleans a wafer, determines a running region according to the setup parameter, and determines the running time of the megasonic spryer in each partition according to the partition number and time proportion in the setup parameter; the running trajectory of the megasonic sprayer in each partition can be fit according to the running time of the megasonic sprayer in each partition; the controller of the megasonic cleaning equipment can control the megasonic sprayer to perform special cleaning at a specific region from a set running starting point to the running terminationbased on the running trajectory, thereby improving a cleaning effect on the wafer.

Description

technical field [0001] The present invention relates to the technical field of megasonic cleaning, in particular to a megasonic cleaning method, device and megasonic cleaning equipment. Background technique [0002] The principle of megasonic cleaning is that the transducer emits a high-energy sound wave with a frequency of 0.8MHz and a wavelength of 1.5m, which produces a high-energy (850kHz) frequency vibration effect and combines the chemical reaction of the chemical cleaning agent to clean the wafer. [0003] Traditional single-wafer megasonic cleaning equipment consists of a mechanical swing arm with a megasonic nozzle and a wafer rotation bracket. When the wafer rotation bracket is rotating, the mechanical swing arm carries the megasonic nozzle to clean the surface of the wafer. Scanning motion to clean the wafer. [0004] At present, the mechanical swing arm in the single-wafer megasonic cleaning equipment moves at a constant speed with the megasonic nozzle. It can o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/67B08B3/12
Inventor 李嘉浪周庆亚田洪涛张金环杨旭李婷蒋锡兵
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD